Ultrasonic Wave Sensing Module Adapter Design

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Solution Overview

Problem

Existing ultrasonic wave sensing modules face challenges in assembling complexity and waterproofing efficiency, leading to potential moisture and dust ingress that can cause short circuits and affect performance.

Innovation Solution

An ultrasonic wave sensing module design featuring a housing with separate containing spaces, an adapter integrally formed with the blocking wall via insert molding to connect the ultrasonic wave sensor and circuit board, and additional sealing measures like waterproof glue and a sealing cover to enhance waterproof and dustproof effects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If traditional separate connection methods are used to connect ultrasonic wave sensor with circuit board, then electrical connection can be achieved, but assembling process becomes complex and waterproofing effect deteriorates

Engineering Contradiction:
Improveassembling processVSAvoidwaterproof effect
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The adapter integrates multiple functions into a single component: it provides electrical connection through connecting pins while simultaneously serving as a sealing element that blocks moisture and dust. The adapter is molded directly onto the blocking wall, combining structural support, electrical connection, and sealing functions in one integrated part, thereby simplifying assembly and improving waterproofing.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The adapter acts as an intermediary component between the ultrasonic wave sensor and the circuit board. It provides a standardized connection interface that simplifies assembly while maintaining effective sealing. The adapter's connecting pins establish electrical contact while the adapter body itself forms the sealing barrier, mediating both electrical and environmental protection functions.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of manufacture

If multiple separate components are used for connection and sealing, then electrical connection is established, but device complexity increases

Engineering Contradiction:
Improveconnection methodVSAvoidnumber of components
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The adapter merges what would traditionally be separate components (connection pins, sealing elements, and mounting structure) into a single integrated part. This reduces the total number of components that need to be manufactured, stored, and assembled, thereby reducing device complexity while maintaining effective electrical connection.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If traditional sealing methods are applied, then some waterproof protection is achieved, but sealing effectiveness deteriorates under harsh conditions

Engineering Contradiction:
Improvewaterproof capabilityVSAvoidmoisture and dust ingress
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The adapter incorporates a sealing cover that acts as a flexible protective barrier. This sealing cover conformally seals around the ultrasonic wave sensor and connecting pins, creating an effective barrier against moisture and dust ingress that maintains waterproof capability under various environmental conditions.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The adapter is constructed using composite material approaches, combining the blocking wall structure with molded sealing elements and the sealing cover. This multi-layer composite structure provides enhanced protection against moisture and dust compared to single-material sealing methods, improving overall waterproof effectiveness.

Inventive Principle:
Principle #40Composite materials

Data Source

PatentUS10234312B2Ultrasonic wave sensing module
Publication Date: 2019.03.19 MAGNA ELECTRONICS SOLUTIONS
  • US10234312B2 patent drawing
  • US10234312B2 patent drawing
  • US10234312B2 patent drawing

AI summary

A method of forming an ultrasonic wave sensing module for a vehicle includes providing a housing having a first containing space and a second containing space separated from each other by a blocking wall, and providing an adapter at the blocking wall that includes a first connecting portion and a first connecting pin. An ultrasonic wave sensor is disposed in the first containing space and a circuit board is disposed in the second containing space. A second connecting pin of the ultrasonic wave sensor extends into the blocking wall and is coupled to the first connecting portion of the adapter at the blocking wall. A second connecting portion of the circuit board is coupled to the first connecting pin of the adapter. The ultrasonic wave sensor is electrically connected with the circuit board via the adapter.