Ultrasonic Sensor Assembly Automation via Modular Segmentation
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Solution Overview
Problem
The existing ultrasonic sensor assembly is complex and difficult to assemble accurately due to its manual assembly process, which increases manufacturing costs and complexity, especially when connecting the PCB to the lead wire and coating the sound-absorbing material.
Innovation Solution
The ultrasonic sensor assembly features a hollow housing with a through hole and an open end accommodating port, allowing for easy assembly of components like the piezo-electric element, PCB, and sound-absorbing material, with a fixing member and ring rubber for secure alignment and protection, enabling automation of the assembly process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the existing ultrasonic sensor assembly structure is used, then the sensor functionality is maintained, but the assembly process becomes complex and difficult to assemble accurately
Solution Approach 1:
The sensor assembly is divided into distinct modular components: a housing assembly containing the piezoelectric element and sound-absorbing material, a separate PCB assembly with connection terminals, and a mounting bracket. These segmented modules can be manufactured independently and then easily assembled together, reducing overall assembly complexity while maintaining functionality.
Solution Approach 2:
A mounting bracket serves as an intermediary component that facilitates the connection between the housing assembly and the PCB assembly. This intermediate element provides alignment features and connection points, making the assembly process more straightforward and accurate without requiring complex direct integration.
2Ease of manufacture
If manual assembly process is used for connecting PCB to lead wire and coating sound-absorbing material, then assembly flexibility is maintained, but manufacturing costs increase
Solution Approach 1:
The sound-absorbing material is pre-coated onto the housing interior surface before final assembly, and the PCB connection terminals are pre-positioned with alignment features. These preliminary actions eliminate the need for costly manual operations during final assembly, enabling automated manufacturing processes while controlling costs.
Solution Approach 2:
The manual mechanical connection process between PCB and lead wire is replaced with an automated electrical connection system using pre-positioned connection terminals and conductive adhesives. This substitution eliminates manual labor requirements and enables automated assembly lines, reducing manufacturing costs while maintaining assembly flexibility.
3Ease of manufacture
If the housing top is closed structure, then protection is provided, but element assembly becomes difficult
Solution Approach 1:
Instead of assembling elements from the bottom up through a closed housing, the design inverts the assembly approach by providing open access at the top of the housing. Elements such as the piezoelectric element and sound-absorbing material can be installed from the top opening, then the housing is sealed to provide protection. This inverted assembly sequence simplifies element installation while maintaining protective enclosure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the assembly process, reduces manufacturing costs, and ensures accurate alignment and secure connection of components, facilitating an automated assembly method while maintaining the sensor's functionality.
Implementation Method 1
Fast vibrations equal to the number of frequencies are caused by applying high-frequency electric energy to a ceramic element, in which case when the applied frequency is 20 KHz or higher, the ceramic element generates an inaudible ultrasonic wave having a specific frequency band according to the vibrations
Implementation Method 2
a sound absorbing material 50 that maintains a constant attenuation of a vibration of the case 10
Data Source
AI summary
Provided is an ultrasonic sensor assembly. The present invention simplifies an assembly structure of the ultrasonic sensor assembly, and thus enables a process of the ultrasonic sensor assembly to be performed as an automation process.


