Ultrasonic Sensor Hermetic Board Sealing
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Solution Overview
Problem
Conventional ultrasonic sensors used in vehicles face issues with increased weight and cost due to filler materials, which can cause distortions in the circuit board and alter sensing area characteristics, and have lengthy manufacturing times.
Innovation Solution
An ultrasonic sensor design that eliminates the need for filler materials by using a hermetically sealed board storing portion with a cover member, enhancing waterproof properties through welding or adhesive bonding, and incorporating a seal plate and adhesive agent to prevent moisture infiltration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If filler material is filled in the housing to secure waterproof property and vibration resistance, then waterproof property and vibration resistance are improved, but weight and cost are increased
Solution Approach 1:
The housing is divided into a water-proof housing and a board storing portion that are hermetically sealed from each other. The circuit board is isolated in its own sealed compartment, separating the waterproofing function from the circuit board mounting function. This allows the board storing portion to be lightweight without filler material while the water-proof housing maintains waterproof protection.
Solution Approach 2:
The circuit board is extracted from the main housing and placed in a separate board storing portion. This extraction allows the circuit board to be protected in its own hermetically sealed compartment without requiring the entire housing to be filled with heavy filler material for waterproofing.
2Reliability
If filler material is filled in the housing to secure waterproof property and vibration resistance, then waterproof property and vibration resistance are improved, but cost is increased
Solution Approach 1:
The housing is segmented into distinct sealed compartments, eliminating the need for expensive filler materials. The hermetic sealing is achieved through structural design with sealing portions and hermetic seals, reducing material costs while maintaining waterproof protection.
3Reliability
If filler material is filled in the housing, then waterproof property and vibration resistance are improved, but distortions are generated in the circuit board
Solution Approach 1:
The circuit board is isolated in a separate board storing portion that is hermetically sealed from the water-proof housing. This segmentation prevents the circuit board from being exposed to filler materials, eliminating the source of thermal expansion stresses that cause distortions and solder joint cracks.
4Reliability
If filler material is filled in the housing, then waterproof property and vibration resistance are improved, but sensing area characteristics are changed
Solution Approach 1:
The transceiver device is housed in a separate water-proof housing that is hermetically sealed from the board storing portion. This segmentation isolates the transceiver device from filler materials, preventing changes in sensing area characteristics such as narrowing of the sensing area that occur when filler material is applied.
5Reliability
If filler material is filled in the housing, then waterproof property and vibration resistance are improved, but manufacturing time is increased
Solution Approach 1:
The housing is designed as segmented components (water-proof housing and board storing portion) that can be assembled separately and hermetically sealed. This modular approach eliminates the time-consuming drying process required for filler materials while maintaining waterproof protection, significantly reducing manufacturing time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces weight and cost, prevents circuit board distortions, and shortens manufacturing time while maintaining waterproof integrity.
Implementation Method 1
a cover member installed in the opening of the board storing portion to hermetically seal the board storing portion
Implementation Method 2
the cover member installed in the opening may be welded to the housing
Implementation Method 3
the cover member may be laser-welded to the housing
Implementation Method 4
the cover member is ultrasonically welded to the housing
Implementation Method 5
the cover member installed in the opening may be adhesively bonded to the housing
Data Source
AI summary
An ultrasonic sensor includes a transceiver device for transmitting and receiving ultrasonic waves; a circuit board mounted with an electronic circuit processing ultrasonic signals transmitted and received through the transceiver device; a housing including a device storing portion storing the transceiver device, a board storing portion storing the circuit board and a communication hole for bringing the device storing portion and the board storing portion into communication with each other, the board storing portion having an opening; and an electric connection unit extending through the communication hole to electrically interconnect the transceiver device and the circuit board. A cover member is installed in the opening of the board storing portion to hermetically seal the board storing portion.