Ultrasonic Sensor Mounting Structure for Collective Heat Treatment

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Solution Overview

Problem

Existing methods for mounting IC chips on substrates require individual heat treatment for each chip, leading to low productivity due to the need for separate curing processes.

Innovation Solution

A mounting body configuration that includes a circuit substrate with a holder, a first wiring layer, a diaphragm, a piezoelectric element, and a second wiring layer, allowing for simultaneous heat treatment of multiple element substrates and circuit substrates without using bumps, thereby improving productivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If individual heat treatment is performed for each IC chip after mounting, then proper curing and mounting quality are achieved, but productivity is reduced due to sequential processing

Engineering Contradiction:

Improvemounting qualityVSAvoidproductivity

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent merges multiple individual heat treatment processes into a single collective heat treatment process. By designing the mounting body with integrated wiring layers that electrically connect multiple element substrates to a circuit substrate, the system enables simultaneous curing of multiple IC chips in one heat treatment cycle, thereby maintaining mounting quality while significantly improving productivity

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent performs preliminary electrical connection between multiple element substrates and the circuit substrate through wiring layers before the final heat treatment process. This preliminary arrangement of electrical connections allows the system to undergo collective heat treatment as a unified structure, eliminating the need for sequential individual treatment and enabling high-throughput manufacturing

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables collective heat treatment of multiple substrates, reducing time and man-hours required, thus enhancing productivity and efficiency in the manufacturing process.

Implementation Method 1

a piezoelectric element provided on a face of the diaphragm at a side opposite to the first opening

Methodology Applied

Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentUS20260006722A1Mounting Body, Ultrasonic Sensor, And Multi-Feed Detection Device

Publication Date: 2026.01.01 SEIKO EPSON CORP

AI summary

The circuit substrate 100 includes the first wiring layer 130 electrically coupled to the circuit 110, the element substrate 200 includes a first substrate 210, a diaphragm 240, a piezoelectric element, the second substrate 220, and a second wiring layer 230 electrically coupled with the piezoelectric element, and it includes the third wiring layer 330 coupled with the first wiring layer 130 and second wiring layer 230, and the protector 310 that covers the third wiring layer 330.