Ultrasonic Sensor Integrated into Connecting Element
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Solution Overview
Problem
Ultrasonic sensors with PVDF foils or piezoceramic materials face temperature instability, leading to adhesive detachment and incorrect measurements due to high temperature stresses, while manual masking for vapor deposition is time-consuming and limited to simple structures, hindering the production of complex ultrasonic sensor arrays.
Innovation Solution
Automated or semi-automated production of ultrasonic sensors using laser cutting to create electrodes on connecting components, allowing for complex geometries and improved adhesion, eliminating the need for a protective layer and enabling accurate temperature and force measurements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If PVDF foils or piezoceramic sensors are glued onto connecting components, then ultrasonic sensing capability is achieved, but adhesive detachment occurs under high temperature stresses leading to measurement errors
Solution Approach 1:
The patent integrates the ultrasonic sensor directly into the connecting component by forming piezoelectric layers and electrodes on the component itself, eliminating the need for separate sensors and adhesive bonding. This merging of sensor and component ensures they experience identical thermal expansion and eliminates adhesive detachment issues under temperature stress.
Solution Approach 2:
The patent replaces the mechanical adhesive bonding system with a vapor deposition process that directly forms piezoelectric layers and metallization layers on the connecting component surface. This substitution eliminates the adhesive layer that causes detachment, using instead a direct physical vapor deposition method for sensor integration.
2Ease of manufacture
If manual masking is used for vapor deposition of piezo layers, then electrode structures can be created, but the process is time-consuming and limited to simple geometries
Solution Approach 1:
The patent replaces the manual mechanical masking process with a vapor deposition method using programmable mask patterns. The mask can be automatically positioned and patterned using computer-controlled mechanisms, enabling complex electrode geometries to be created without manual intervention and significantly reducing production time.
Solution Approach 2:
The patent changes the mask from a fixed physical constraint to a programmable pattern that can be dynamically adjusted. By varying the mask pattern parameters through software control, different electrode geometries can be produced on the same component without changing physical masks, enabling complex structures and high-volume production.
3Object-affected harmful factors
If a protective layer is applied over the piezo layer, then environmental protection is provided, but the layer structure becomes more complex and adhesion issues may arise
Solution Approach 1:
The patent uses a metallization layer composed of multiple material layers (e.g., chromium, gold, or other conductive materials) that simultaneously provides electrical conductivity, environmental protection, and mechanical adhesion. This composite metallization structure eliminates the need for separate protective layers while maintaining all necessary functions.
Solution Approach 2:
The metallization layer is designed to perform multiple functions simultaneously: it serves as the electrode for ultrasonic generation, provides environmental protection for the piezoelectric layer, ensures mechanical adhesion, and enables electrical connectivity. This multi-functionality reduces the overall layer structure complexity while maintaining protective capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method ensures high adhesion forces between the sensor and the component, reducing signal propagation errors and enabling accurate determination of clamping forces, while allowing for the production of complex ultrasonic sensor arrays with improved resistance to environmental factors.
Implementation Method 1
at least one structure producing at least one electrode is lasered out on the metallization layer
Implementation Method 2
a piezo layer is sputtered onto one of the two ends of the cleaned connecting elements
Data Source
AI summary
The invention relates to a connecting component (1) with an integrated ultrasonic sensor (5), wherein the ultrasonic sensor has a layer structure (20) comprising at least two layers (21, 23) with an electrode layer (21) and at least one layer (23) of a material with piezoelectric properties. The at least one electrode layer (21) and the at least one layer (23) of a material with piezoelectric properties are arranged at a freely accessible end (25, 27) of the connecting component (1). Structures (40, 46, 50) for generating electrodes by laser-cut areas (30, 31) are formed in the electrode layer (21).