Ultrasonic Sensor Groove Substrate Isolation
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Solution Overview
Problem
Conventional ultrasonic sensors experience energy loss and reduced sensitivity due to the absorption of mechanical vibration signals by the substrate, leading to inefficient ultrasonic wave transmission and reception.
Innovation Solution
The ultrasonic sensor design incorporates a substrate with a groove that minimizes direct contact between the sensor component and the substrate, featuring a piezoelectric layer between electrodes and a planarization layer with via holes to reduce energy loss, enhancing sensitivity by preventing downward ultrasonic wave transmission and optimizing mechanical vibration absorption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the sensor component is placed directly on the substrate, then the manufacturing process is simple, but the substrate absorbs mechanical vibration signals causing energy loss and reduced sensitivity
Solution Approach 1:
The substrate is segmented by creating a groove that divides the contact area, separating the region directly under the piezoelectric layer from the surrounding substrate. This segmentation prevents the entire substrate from absorbing mechanical vibrations, reducing energy loss while maintaining manufacturing simplicity through a single groove formation step.
Solution Approach 2:
The harmful substrate material is extracted by removing it in the form of a groove underneath the piezoelectric layer. This extraction eliminates the substrate's harmful absorption effect in the critical region while maintaining the overall structural integrity and simplicity of the device.
2Device complexity
If the sensor component is placed directly on the substrate, then the device structure is simple, but the sensitivity of the ultrasonic sensor is reduced due to substrate interference
Solution Approach 1:
The substrate contact area is segmented by introducing a groove, creating distinct regions: a non-contact region under the piezoelectric layer and contact regions at the edges. This segmentation isolates the sensitive piezoelectric layer from substrate interference, improving sensitivity while adding minimal structural complexity.
Solution Approach 2:
The substrate interaction is made non-uniform by creating a groove only in the region directly under the piezoelectric layer. This local modification provides different mechanical properties in different regions: isolation where needed (under the piezoelectric layer) and support where beneficial (at the edges), optimizing sensitivity without excessive complexity.
3Strength
If the piezoelectric layer is in direct contact with the substrate, then the mechanical support is sufficient, but the ultrasonic wave transmission efficiency is reduced due to energy absorption
Solution Approach 1:
The contact between the piezoelectric layer and substrate is segmented by the groove, creating partial contact rather than full contact. This segmentation maintains mechanical support through edge contact while eliminating energy loss by preventing direct transmission of vibrations into the substrate bulk.
Solution Approach 2:
The groove acts as an intermediary structure that mediates between the need for mechanical support and the need to prevent energy loss. By providing support at the edges while creating an air gap or void in the center, the groove structure enables both functions to coexist.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces energy loss and improves the sensitivity of the ultrasonic sensor by minimizing substrate interference with mechanical vibrations, ensuring better ultrasonic signal quality and performance.
Implementation Method 1
a piezoelectric layer located between the first electrode and the second electrode
Implementation Method 2
Conventional ultrasonic sensors experience energy loss and reduced sensitivity due to the absorption of mechanical vibration signals by the substrate
Data Source
AI summary
The embodiments of the present disclosure disclose an ultrasonic sensor, a manufacturing method thereof, and a display device. The ultrasonic sensor includes a substrate and at least one sensor component located on the substrate. The sensor component includes a first electrode, a second electrode, and a piezoelectric layer located between the first electrode and the second electrode. The substrate is provided with a groove on a side close to the sensor component, and the orthographic projection of the piezoelectric layer on the substrate has a portion overlapping with a region of the groove in the substrate.