Ultrasonic SMD Mounting with Movable Heating Unit
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Solution Overview
Problem
Conventional ultrasonic bonding apparatuses face challenges in maintaining the temperature of surface-mounted devices (SMDs) during mounting due to changes in oscillation characteristics caused by heating units, leading to unreliable bonding between SMDs and receiving devices, especially as devices miniaturize and heat radiation increases.
Innovation Solution
A mounting apparatus with a movable heating unit that surrounds the SMD holding unit non-contactually, an interlocking mechanism to maintain temperature, and a thermal shield unit to isolate heat from the vibration generating unit, ensuring consistent ultrasonic vibration application and maintaining the SMD at suitable bonding temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a heating unit is integrated into the SMD holding unit, then the SMD can be heated to strengthen bonding strength, but the oscillation characteristic of the holding unit changes making it difficult to apply predetermined ultrasonic vibration
Solution Approach 1:
The heating function is separated from the ultrasonic vibration transmission path. The heating unit is positioned to heat the SMD indirectly through radiation or convection rather than being integrated into the holding unit that transmits ultrasonic vibration, thus maintaining oscillation characteristics while achieving heating for bonding strength
Solution Approach 2:
An intermediary heating method is used where the heating unit does not directly contact the holding unit. Instead, heat is applied through an intermediate medium (such as heated air or radiation) to warm the SMD without affecting the mechanical properties of the holding unit required for ultrasonic vibration transmission
2Ease of operation
If the SMD holding unit is moved after heating, then the SMD can be positioned for bonding, but the temperature of the heated SMD drops making reliable bonding difficult
Solution Approach 1:
The SMD is heated in advance before being moved to the bonding position. The heating unit operates during the positioning phase, and the SMD maintains its elevated temperature throughout the subsequent bonding operation, ensuring optimal conditions for bonding without temperature drop
Solution Approach 2:
The heating action continues during the movement and positioning process. The heating unit remains active throughout the entire sequence from heating to positioning to bonding, maintaining continuous thermal input to prevent temperature drop and ensure reliable bonding conditions
3Volume of moving object
If the holding unit is downsized to accommodate miniaturized SMDs, then smaller devices can be mounted, but heat radiation from the holding unit increases making temperature maintenance more difficult
Solution Approach 1:
A dedicated heating unit acts as an intermediary to provide controlled heating to the miniaturized SMD. This separate heating source compensates for the increased heat radiation from the downsized holding unit, maintaining optimal temperature without requiring the holding unit itself to be a heat source
Solution Approach 2:
The heating parameters (temperature, power, duration) are adjusted and optimized specifically for miniaturized SMDs. The heating unit provides precisely controlled thermal energy to compensate for the higher surface-area-to-volume ratio and increased heat radiation characteristic of smaller devices
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for precise ultrasonic vibration transmission and effective heating of SMDs until bonding, ensuring reliable bonding between SMDs and receiving devices without affecting the oscillation characteristics, even as devices are miniaturized.
Implementation Method 1
a heating unit arranged movably so as to surround in a noncontact manner a portion of the SMD holding unit near the SMD held by the SMD holding unit, and heating the SMD holding unit
Implementation Method 2
a vibration generating unit applying ultrasonic vibration to a contact portion between the SMD held by the SMD holding unit and the SMD receiving device held by the SMD receiving device holding unit
Implementation Method 3
the SMD holding unit comprises a suction nozzle which holds the SMD by a suction force
Data Source
AI summary
A mounting apparatus applies ultrasonic vibration exactly to a junction between a SMD and a SMD receiving device and maintains the junction at the suitable temperature, in simple construction in ultrasonic bonding of the SMD and the SMD receiving device held by holding unit. This includes SMD holding unit, SMD receiving device holding unit, moving unit moving at least one of the SMD holding unit and SMD receiving device holding units to contact each other, vibration generating unit applying ultrasonic vibration to the a contact portion between the SMD and the SMD receiving device, pressing unit applying an bias force between the SMD and SMD receiving device, heating unit arranged movably so as to surround in a noncontact manner a portion of the SMD holding unit near the SMD and heating the SMD holding unit, and interlocking unit interlocking the heating unit with the SMD holding unit.