Ultrasonic Solar Substrate Ribbon Bonding System
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Solution Overview
Problem
Current methods for electrical interconnection in solar cell applications, such as soldering or conductive adhesive bonding, are inefficient for forming reliable connections between multiple solar substrates, which hinders the efficient collection of electricity from multiple cells.
Innovation Solution
An ultrasonic solar substrate bonding system that uses a bond head assembly with a bonding tool to form ultrasonic bonds between a continuous length of ribbon material and multiple solar substrates, enabling efficient electrical interconnection by successively bonding the ribbon material to each substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering or conductive adhesive bonding is used to electrically connect solar substrates, then electrical interconnection can be achieved, but the bonding reliability and efficiency are insufficient
Solution Approach 1:
The patent replaces traditional soldering or conductive adhesive bonding methods with ultrasonic bonding technology. The ultrasonic bonding tool uses high-frequency mechanical vibration to directly bond the ribbon material to the solar substrate through friction and pressure, eliminating the need for solder or adhesive materials. This substitution achieves both high bonding reliability through direct metal-to-metal contact and high productivity through rapid bonding cycles without additional material processing steps
Solution Approach 2:
The patent employs ultrasonic vibration parameters (frequency, amplitude, and power) to achieve effective bonding. By controlling the ultrasonic parameters, the system optimizes the bonding process to create strong, reliable electrical connections between the ribbon and solar substrates while maintaining high bonding speed and efficiency
2Reliability
If traditional bonding methods are used, then electrical connection can be formed, but the active material's ability to absorb solar energy may be compromised
Solution Approach 1:
The ultrasonic bonding process applies localized pressure and vibration only at the specific bonding interface between the ribbon and the solar substrate's contact points. This localized action ensures that the electrical connection is formed precisely where needed without affecting the broader active material areas that require solar energy absorption, thus maintaining both connection reliability and energy absorption efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively forms reliable ultrasonic bonds across multiple solar substrates, enhancing the electrical interconnection and facilitating the collection of electricity from multiple cells while maintaining the active material's ability to absorb solar energy.
Implementation Method 1
ultrasonic bonding (e.g., wire bonding, ribbon bonding, etc.) continues to be a widely used method of providing electrical interconnection
Implementation Method 2
Ultrasonic bonding is a joining process that, for example, may use relative motion between the ribbon and the surface it is bonded to. It is this relative motion that enables the bond formation.
Data Source
AI summary
An ultrasonic solar substrate bonding system is provided. The system includes a bond head assembly including a bonding tool for bonding a ribbon material to a plurality of solar substrates. The system also includes a ribbon feeding system successively supplying portions of a continuous length of the ribbon material to the bonding tool such that the bonding tool forms ultrasonic bonds between the portions of the continuous length of the ribbon material and a plurality of solar substrates.