Ultrasonic Singulation of Solder Microspheres to Prevent Agglomeration

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Solution Overview

Problem

Solder microspheres tend to agglomerate in hoppers, leading to reduced singulation efficiency and potential damage, especially as their size decreases, causing bridging issues that hinder the downstream process and result in tool downtime.

Innovation Solution

A piezoelectric vibration device is used to provide ultrasonic vibrations to the singulation device, preventing agglomeration by fluidizing the solder microspheres and ensuring they remain separate within the hopper.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If solder microspheres are stored in a hopper for downstream processing, then they are readily available for use, but they tend to agglomerate and form bridges that hinder the process

Engineering Contradiction:

Improvereadiness for useVSAvoidagglomeration and bridging

Core Design Contradiction:

Ease of operationVSObject-generated harmful factors

Solution Approach 1:

A piezoelectric vibration device is coupled to the singulation device and configured to provide ultrasonic vibrations to the moveable singulation device. These vibrations fluidize the solder microspheres in the hopper, preventing them from agglomerating and forming bridges, thereby maintaining their flowability and readiness for use.

Inventive Principle:

Principle #18Mechanical vibration

Solution Approach 2:

The piezoelectric vibration device changes the physical state of the solder microspheres by applying ultrasonic vibrations, transforming them from a static agglomerated state to a fluidized state. This parameter change in vibration frequency and intensity prevents agglomeration while maintaining ease of operation.

Inventive Principle:

Principle #35Parameter changes

2Manufacturing precision

If the size of solder microspheres is reduced to achieve finer features, then manufacturing precision is improved, but singulation efficiency decreases due to increased agglomeration

Engineering Contradiction:

Improvefeature sizeVSAvoidsingulation efficiency

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The ultrasonic vibrations from the piezoelectric device specifically target and fluidize smaller solder microspheres that are prone to agglomeration. This maintains singulation efficiency despite using smaller sphere sizes for finer manufacturing features.

Inventive Principle:

Principle #18Mechanical vibration

Solution Approach 2:

The patent replaces passive gravity-based singulation with an active vibration-assisted system. The ultrasonic vibrations substitute for mechanical intervention that would otherwise be needed to break up agglomerates, maintaining productivity while enabling smaller feature sizes.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Quantity of substance

If solder microspheres agglomerate in the hopper, then material concentration increases, but singulation efficiency and process continuity are reduced

Engineering Contradiction:

Improvematerial concentrationVSAvoidprocess continuity

Core Design Contradiction:

Quantity of substanceVSReliability

Solution Approach 1:

The vibration device maintains uniform distribution of solder microspheres in the hopper, preventing localized agglomeration. This ensures consistent material concentration and reliable continuous operation without process interruptions.

Inventive Principle:

Principle #18Mechanical vibration

Solution Approach 2:

By continuously applying ultrasonic vibrations, the system maintains the solder microspheres in a fluidized state throughout the process, ensuring continuous reliable operation without interruptions from agglomeration-related failures.

Inventive Principle:

Principle #20Continuity of useful action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The ultrasonic vibrations effectively prevent piling and bridging of solder microspheres, maintaining their separation and enhancing singulation efficiency, thus reducing tool downtime and ensuring a smooth process.

Implementation Method 1

a piezoelectric vibration device configured to provide ultrasonic vibrations to the singulation device

Methodology Applied

Scientific EffectPiezoelectric effect: Piezoelectric Effect

Implementation Method 2

provide ultrasonic vibrations to the moveable singulation device to prevent agglomeration

Methodology Applied

Scientific EffectUltrasonic vibration: Ultrasonic Vibration

Data Source

PatentUS11247285B1Fluidization of agglomerated solder microspheres

Publication Date: 2022.02.15 SEAGATE TECH LLC

AI summary

An apparatus includes a hopper configured to receive a plurality of solder microspheres, and a moveable singulation device positioned proximate to and below the hopper. The moveable singulation device is configured to receive the plurality of solder microspheres from the hopper as the plurality of microspheres exit the hopper. The movable singulation device includes a plurality of holes, with each of the plurality of holes configured to receive a single solder microsphere of the plurality of solder micro spheres. The apparatus further includes a piezoelectric vibration device configured to provide ultrasonic vibrations to the singulation device, thereby preventing agglomeration of the plurality of solder microspheres in the hopper.