Ultrasonic Soldering for Thermally Sprayed Heating Layers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional soldering methods for thermally sprayed layers in domestic appliances face challenges such as difficulty in adhesion due to oxide layers, flux penetration into porous layers, and complex masking requirements, leading to inefficiencies and potential impairment of electrical insulation.
Innovation Solution
The use of ultrasonic soldering to break up the oxide skin on thermally sprayed layers, allowing for direct adhesion of solder without flux, enabling efficient electrical connections with low resistance and high conductivity, suitable for both low and high voltage applications, and adaptable to non-wettable surfaces like ceramics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional soldering with flux is used on thermally sprayed layers, then adhesion of solder is enabled, but flux penetrates into porous layers and impairs electrical insulating property
Solution Approach 1:
The harmful flux is completely removed from the soldering process. Instead of using flux to enable adhesion, the patent applies solder directly to the thermally sprayed layer, eliminating the source of the harmful penetration and insulation impairment.
Solution Approach 2:
The thermally sprayed layer itself serves as the intermediary surface for solder adhesion without requiring flux as a mediator. The layer's surface properties enable direct solder bonding, replacing flux's mediating role while avoiding its harmful effects.
2Reliability
If thermally sprayed metals are used for connecting areas, then electrical conductivity is improved, but complex masking is required and wear is high
Solution Approach 1:
The thermally sprayed layer serves itself by providing both the conducting surface and the adhesion surface for solder. No separate masking or additional protective layers are needed, as the layer's properties directly enable the soldering process without external assistance.
Solution Approach 2:
The thermally sprayed layer performs multiple functions: it provides electrical conductivity, serves as the bonding surface for solder, and eliminates the need for masking. This multi-functionality reduces device complexity while maintaining electrical performance.
3Reliability
If flux is used to break up oxide skin, then solder adhesion is enabled, but thorough washing with solvent is required to prevent negative influence
Solution Approach 1:
The flux and the subsequent washing process are completely extracted from the soldering procedure. By applying solder directly to the thermally sprayed layer without flux, the entire sequence of flux application and solvent washing is eliminated, saving time while maintaining adhesion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ultrasonic soldering provides strong, reliable, and corrosion-resistant connections with improved material efficiency and reduced cycle time and costs, maintaining adhesion strength under temperature variations and high continuous operation, and is suitable for high voltage and high temperature applications.
Implementation Method 1
The use of ultrasonic soldering to break up the oxide skin on thermally sprayed layers
Implementation Method 2
at least one solder volume that is applied to at least one thermally sprayed-on layer structure, wherein the at least one solder volume is an ultrasonically soldered-on solder volume
Data Source
AI summary
A heating device for a domestic appliance includes a planar carrier having a carrier surface. Thermally sprayed onto the carrier surface is a layer structure, and a first solder volume is applied to the layer structure. The solder volume is an ultrasonically soldered-on solder volume. The layer structure can hereby be a heating conductor layer.