Ultrasonic Soldering Tip for Conductive Coating
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for producing panes with electrically conductive coatings and metallic strips require multiple soldering steps, increasing production time and cycle times, which is undesirable for industrial mass production.
Innovation Solution
A method involving ultrasonic soldering that uses a metallic strip with a through-hole and soldering compound arranged on both sides of the hole to create a stable mechanical connection between the conductive coating and the metallic strip in a single step, eliminating the need for additional soldering methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple soldering steps are used to create a stable connection between the conductive coating and metallic strip, then the mechanical stability is improved, but the production time increases
Solution Approach 1:
The patent combines ultrasonic cleaning and ultrasonic soldering into a single processing step. The ultrasonic soldering tip simultaneously cleans the surface of the conductive coating and creates the mechanical connection through ultrasonic vibrations, eliminating the need for separate cleaning and soldering operations while achieving stable adhesion
Solution Approach 2:
The invention utilizes ultrasonic vibrations (mechanical vibration) to achieve both surface cleaning and soldering in one step. The ultrasonic tip generates high-frequency vibrations that remove oxides and contaminants from the conductive coating surface while simultaneously melting the solder and creating a strong mechanical bond, resolving the contradiction between connection stability and production time
2Productivity
If ultrasonic soldering is used alone without additional soldering methods, then the production efficiency is improved, but the mechanical connection stability may be insufficient
Solution Approach 1:
The patent modifies key parameters of the ultrasonic soldering process, including the geometry of the ultrasonic tip (contoured surface), the power level, and the solder composition (tin-lead or tin-silver alloy). These parameter changes enable the ultrasonic vibrations to generate sufficient heat and mechanical energy to create stable solder joints with strong mechanical adhesion, achieving both high productivity and reliable connections
3Manufacturing precision
If a contoured ultrasonic soldering tip is used, then the soldering effectiveness is improved, but the device complexity increases
Solution Approach 1:
The ultrasonic soldering tip features a contoured surface with specific local geometries (radius of curvature between 0.5-2.0 mm) concentrated at the contact point with the conductive coating. This localized geometric feature enhances the ultrasonic energy transfer and soldering effectiveness precisely where needed, while the rest of the tip maintains a simple cylindrical form, thus achieving high soldering precision without excessive overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a stable mechanical connection and reduces production time by completing the soldering process in a single ultrasonic soldering step, enhancing efficiency in mass production.
Implementation Method 1
Ultrasonic oscillations are transferred to the metallic strip via a soldering tip. By means of the ultrasonic oscillations, improved adhesion between the soldering compound and the surfaces is achieved
Implementation Method 2
Soldering the metallic strip to the electrically conductive coating via a soldering compound using an ultrasonic soldering tip
Data Source
AI summary
A method for producing a pane with an electrically conductive coating and a metallic strip soldered thereon is described. The method includes providing a substrate with an electrically conductive coating, providing a metallic strip with at least one through-hole, positioning the metallic strip on the electrically conductive coating, wherein the hole is arranged on the electrically conductive coating, and soldering the metallic strip to the electrically conductive coating via a soldering compound using an ultrasonic soldering tip.