Ultrasonic Cleaning Head for Substrate Underside
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Solution Overview
Problem
Conventional substrate treatment apparatuses face challenges in effectively cleaning the underside of substrates due to limitations in installing ultrasonic cleaning units and supplying cleaning liquids, especially when the substrate is rotating.
Innovation Solution
A substrate treatment apparatus with an ultrasonic cleaning unit is designed, featuring an ultrasonic cleaning head extending radially with an inner and outer cleaning liquid supply tube system, where the inner liquid is applied near the center and the outer liquid is applied near the peripheral edge, allowing for comprehensive cleaning. The apparatus includes a fluid movement guide tube and plate-shaped vibrators to enhance cleaning efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional back nozzle assembly is disposed on the chuck base to clean the underside of the substrate, then cleaning can be performed, but the cleaning effectiveness is insufficient compared to ultrasonic cleaning
Solution Approach 1:
The patent introduces an ultrasonic cleaning unit that generates ultrasonic vibrations to clean the underside of the substrate. The ultrasonic cleaning head is disposed on the chuck base and emits ultrasonic waves through the substrate, achieving superior cleaning effectiveness compared to conventional nozzle assemblies. This resolves the contradiction by adopting mechanical vibration (ultrasonic) to enhance cleaning reliability while maintaining structural feasibility.
2Reliability
If an ultrasonic cleaning unit is installed under the rotating substrate, then excellent cleaning effectiveness is achieved, but space installation is limited and cleaning liquid supply is difficult
Solution Approach 1:
The patent positions the ultrasonic cleaning head on the chuck base (top side) rather than attempting to install it on the bottom side of the rotating substrate. This dimensional repositioning allows the cleaning unit to access the underside of the substrate through the rotating motion, solving the space installation problem while enabling cleaning liquid supply through the chuck base structure.
Solution Approach 2:
The chuck base structure is designed to serve multiple functions: it supports the substrate during rotation, accommodates the ultrasonic cleaning head, and provides cleaning liquid supply pathways. By making the chuck base multi-functional, the patent eliminates the need for separate installation structures and simplifies cleaning liquid delivery to the ultrasonic cleaning unit.
3Reliability
If cleaning liquid is supplied to the entire substrate surface, then comprehensive cleaning is achieved, but liquid distribution uniformity becomes difficult to control
Solution Approach 1:
The cleaning liquid supply system is segmented into multiple nozzles positioned at different locations on the chuck base. This segmentation allows independent control of liquid flow to different regions of the substrate, ensuring uniform distribution across the entire surface while maintaining comprehensive cleaning coverage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables uniform and effective cleaning of the entire substrate surface, including the underside, by utilizing ultrasonic vibrations and strategically positioned cleaning liquid supply paths, overcoming previous limitations in substrate cleaning.
Implementation Method 1
an ultrasonic cleaning unit disposed on top of the chuck base and under the substrate to perform ultrasonic cleaning for the underside of the substrate
Data Source
AI summary
The present invention relates to a substrate treatment apparatus including: a chuck base rotatably disposed around a rotating shaft; chuck pins disposed on top of the chuck base to fix a substrate thereto; and an ultrasonic cleaning unit disposed on top of the chuck base to perform ultrasonic cleaning for the underside of the substrate.