Ultrasonic Testing Device for Packaged Semiconductor
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Solution Overview
Problem
Existing ultrasonic testing devices face challenges in testing packaged semiconductor devices, as the semiconductor chip is not visible from the outside, and there is a need to increase the intensity of the output signal for improved testing accuracy.
Innovation Solution
An ultrasonic testing device is designed with a signal generation unit that sets an optimal frequency for the driving signal to maximize the absorption of the ultrasonic wave in the semiconductor device, thereby increasing the intensity of the output signal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the semiconductor device is tested in a packaged state, then the testing process becomes simpler and avoids chip ejection, but the semiconductor chip is not visible from the outside making testing difficult
Solution Approach 1:
The patent replaces optical detection methods with ultrasonic wave detection. Instead of visually observing the chip, the system uses ultrasonic waves to stimulate the semiconductor device and detect electrical signal changes, enabling testing of packaged devices without visual access to the chip.
Solution Approach 2:
The patent introduces ultrasonic waves as an intermediary between the testing system and the semiconductor device. The ultrasonic oscillator generates ultrasonic waves that penetrate the package, stimulate the chip, and the resulting electrical signal changes are detected, allowing indirect observation of chip functionality.
2Measurement precision
If the intensity of ultrasonic wave is increased to improve output signal intensity, then testing accuracy improves, but energy consumption increases and may damage the device
Solution Approach 1:
The patent utilizes mechanical vibration through ultrasonic waves to stimulate the semiconductor device. By controlling the frequency and intensity of ultrasonic vibrations, the system achieves sufficient output signal intensity for accurate testing while minimizing energy consumption and avoiding device damage.
Solution Approach 2:
The patent employs signal generation units to precisely control parameters of ultrasonic waves, including frequency and intensity. By optimizing these parameters, the system achieves the minimum necessary ultrasonic intensity to generate detectable output signals without excessive energy consumption or device damage.
3Power
If the frequency of driving signal is optimized to maximize ultrasonic wave absorption, then output signal intensity increases, but requires complex frequency analysis and adjustment
Solution Approach 1:
The patent implements feedback mechanisms where the system analyzes the output signals from the semiconductor device and adjusts the driving signal frequency accordingly. The signal generation units modify the ultrasonic frequency based on detected signal characteristics, creating a closed-loop system that optimizes output signal intensity automatically.
Solution Approach 2:
The patent performs preliminary frequency analysis to determine the optimal driving signal frequency before conducting the main testing. By pre-analyzing the frequency spectrum of reflected ultrasonic waves and identifying resonance frequencies, the system prepares the optimal stimulation conditions in advance, simplifying the main testing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The optimal frequency setting enhances the resonance of the ultrasonic wave within the semiconductor device, increasing the focused intensity of the ultrasonic wave and improving the testing accuracy by increasing the intensity of the output signal.
Implementation Method 1
the resonance of the ultrasonic wave can be sufficiently generated in the semiconductor device
Implementation Method 2
the temperature of the semiconductor device increases in an irradiation position of the ultrasonic wave
Implementation Method 3
the absorption of the ultrasonic wave in the semiconductor device is maximized
Data Source
AI summary
An ultrasonic testing device having a packaged semiconductor device as a testing target, the device including: an ultrasonic oscillator disposed to face the semiconductor device; a pulse generator generating a driving signal that is used in the generation of an ultrasonic wave to be output from the ultrasonic oscillator; and an analysis unit analyzing an output signal that is output from the semiconductor device in accordance with the irradiation of the ultrasonic wave from the ultrasonic oscillator, in which the pulse generator sets an optimal frequency of the driving signal such that the absorption of the ultrasonic wave in the semiconductor device is maximized.