Ultrasonic Transducer Array for Low-Temperature Semiconductor Test Frost Suppression
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Solution Overview
Problem
Conventional methods for testing semiconductor devices at low temperatures often result in frost formation between the device and the test header, leading to instability, inefficiency, and potential damage during detachment, as they either fail to effectively suppress frost or are costly and time-consuming.
Innovation Solution
An apparatus comprising a platform with a transducer array that generates ultrasonic vibrations controlled by a moisture-sensing system to inhibit frost formation, preventing nucleation and growth, and adjusting defrosting strength based on humidity levels, thereby enhancing test stability and throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling techniques are used to achieve low temperature testing, then the semiconductor device can be tested at low temperatures, but frost formation occurs causing the device to adhere to the test header
Solution Approach 1:
The patent applies ultrasonic vibration to the test header surface to prevent frost adhesion. The vibration frequency and amplitude are controlled to match the resonant frequency of frost crystals, causing them to fragment and detach before they can firmly adhere to the cold surface. This mechanical vibration approach directly addresses the frost formation problem while maintaining low temperature testing conditions.
Solution Approach 2:
The patent converts the harmful effect of frost formation into a beneficial detection mechanism. By monitoring the vibration characteristics of the test header, the system can detect when frost forms and adjust the ultrasonic vibration parameters accordingly. The frost that would normally cause adhesion problems is instead used as a signal to trigger the anti-frost vibration mechanism.
2Ease of operation
If physical separation is used to detach the semiconductor device from the test header, then the device can be removed, but the device surface or test header can be broken
Solution Approach 1:
Instead of using brute-force physical separation that can damage components, the patent uses controlled ultrasonic vibration to create a non-adhesive surface. The vibration prevents frost from forming strong bonds between the device and header, allowing for gentle, damage-free detachment. This approach maintains the integrity of both the device surface and test header while enabling easy removal.
3Object-affected harmful factors
If temperature control with heating scheme is used to remove frost, then frost can be removed, but the test duration increases significantly
Solution Approach 1:
The patent replaces the time-consuming thermal heating method with ultrasonic vibration, which immediately disrupts frost crystal structures. The vibration causes frost to fragment and detach within seconds, eliminating the need for prolonged heating cycles. This maintains test duration while effectively removing frost, unlike the conventional heating approach that can extend testing significantly.
Solution Approach 2:
The ultrasonic vibration induces rapid phase transition in the frost from a stable solid state to fragmented particles that can be easily removed. The mechanical energy from vibration causes the frost crystals to shatter and detach, effectively reversing the freezing process without requiring thermal energy input that would extend test time.
4Object-affected harmful factors
If dry air is used to suppress frost formation, then relative humidity can be decreased, but the relative humidity is very difficult to keep constant in an open test environment
Solution Approach 1:
The patent replaces the unreliable environmental humidity control approach with localized ultrasonic vibration applied directly to the test header surface. This method is independent of ambient humidity conditions and works consistently in open test environments. The vibration creates a protective effect that prevents frost adhesion regardless of the surrounding air humidity, providing reliable frost suppression without the need for precise humidity control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents frost formation, increases test stability and efficiency, and is cost-effective by using ultrasonic vibrations to restrain frost growth, allowing for safer and faster semiconductor device testing in low temperature conditions.
Implementation Method 1
a transducer array configured to generate ultrasonic vibrations
Implementation Method 2
The frost is produced from moisture in the air and the low temperature of the test header
Data Source
AI summary
An apparatus includes a platform and a test board mounted on the platform. The platform generally comprises (i) a transducer array configured to generate ultrasonic vibrations and (ii) a controller configured to control the transducer array in response to measurements of moisture content of air around the platform. The test board may be configured to apply test signals to and receive test responses from a semiconductor device under test. The platform may be configured to utilize the ultrasonic vibrations to inhibit frost formation between the semiconductor device under test and a test header providing a low temperature test condition.