Ultrasonic Transducer 2D Array Grounding Circuit Topology

The patent divides the ultrasonic generating units into multiple independent series strings along different directions. Each series string is electrically isolated from others, allowing independent grounding. This segmentation eliminates the complex interconnecting wiring that causes ground loop and EMS interference while preserving the 2D array's imaging capability through coordinated operation of independent string groups.

The patent introduces a common grounding layer as an intermediary element that provides a uniform reference potential for all ultrasonic generating units. This grounding layer acts as a mediator between the series strings and the substrate, ensuring all units share the same ground reference without requiring complex interconnecting wiring, thus eliminating ground loop and EMS signal interference.

The patent segments the 2D array into multiple independent series strings arranged along different directions. Each series string can be independently grounded through separate grounding electrodes, eliminating the need for a single complex grounding layer that would be required if all units were interconnected. This segmentation reduces wiring complexity while maintaining multi-directional scanning capability.

The patent transitions from a planar grounding approach to a three-dimensional grounding structure by placing grounding electrodes at different locations (around the array perimeter and within the array interior). This spatial redistribution of grounding points eliminates the wiring complexity barrier to implementing a common grounding layer while preserving the 2D array's scanning capability.

The patent segments the grounding function into multiple independent grounding electrodes distributed throughout the array structure. Each series string has its own grounding electrode, ensuring consistent ground reference potential for all units without requiring a single complex grounding layer. This segmentation achieves reliable ground reference consistency while simplifying the overall grounding structure.

The patent applies local grounding electrodes at specific locations within the 2D array rather than relying on a single common grounding layer. Each local grounding electrode provides a dedicated ground reference for its associated series string, ensuring consistent ground potential while allowing flexible placement that avoids wiring complexity issues. This local quality approach achieves reliable grounding without the constraints of traditional designs.