Ultrasonic Transducer Array Bonding Structure for PCB Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional ultrasonic transducers and phased array ultrasonic transducers suffer from reduced performance due to undesired ultrasonic energy being absorbed by the printed circuit board (PCB), which is in direct contact with the transducer membrane, leading to inefficiencies in energy transmission and beam steering.
Innovation Solution
An integrated bonding wire structure is manufactured using additive manufacturing techniques, surrounded by a damping material to attenuate ultrasonic energy before it reaches the PCB, reducing energy absorption and improving contact density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the transducer membrane is in direct contact with the PCB, then the manufacturing is simplified and contact density is improved, but ultrasonic energy is absorbed by the PCB reducing performance
Solution Approach 1:
The patent introduces an intermediary damping material between the transducer membrane and the PCB. This damping material serves as a mediator that allows the membrane to be positioned away from the PCB while still providing necessary electrical and mechanical connections through bonding wires, thereby preventing ultrasonic energy absorption by the PCB while maintaining manufacturing feasibility.
Solution Approach 2:
The patent transitions from a direct two-dimensional contact arrangement (membrane directly on PCB) to a three-dimensional configuration where the membrane is positioned above the PCB with bonding wires providing connections. This dimensional change allows energy isolation while maintaining electrical connectivity.
2Reliability
If multiple PCB layers are used to provide sufficient contacts, then contact density is improved, but the PCB absorbs more ultrasonic energy reducing overall performance
Solution Approach 1:
The damping material acts as an intermediary barrier that prevents ultrasonic energy from reaching the PCB, allowing multiple PCB layers to be used for sufficient contacts without the penalty of energy absorption. The bonding wires provide the necessary connections through the damping material.
Solution Approach 2:
The patent extracts the ultrasonic energy absorption problem from the PCB by introducing a separate damping material layer, allowing the PCB to focus solely on providing sufficient electrical contacts without the harmful side effect of energy absorption.
3Loss of energy
If the membrane is positioned away from the PCB with damping material, then ultrasonic energy transmission is improved, but manufacturing complexity increases
Solution Approach 1:
The patent merges the damping material with the PCB structure, integrating the energy-absorbing function into the existing PCB design rather than adding a completely separate component. This reduces overall structural complexity while maintaining the benefits of energy isolation.
Solution Approach 2:
The damping material serves multiple functions: it prevents ultrasonic energy absorption by the PCB, provides mechanical support for bonding wires, and maintains proper spacing between the membrane and PCB. This multi-functionality reduces the need for additional separate components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances ultrasonic energy transmission and beam steering capabilities by minimizing energy loss to the PCB, thereby improving performance and reducing manufacturing costs through simplified manufacturing processes.
Implementation Method 1
A damping material is added to the bonding wire structure and cured. The damping material may be trimmed to design dimensions... the transducer membrane is laminated on a first face of the damping material... a printed circuit board is laminated to an opposite face. The damping material attenuates ultrasonic energy before it reaches the printed circuit board.
Data Source
Figure 1
Figure 2~4
Figure 5
AI summary
A phased array ultrasonic transducer (100;200;300;400;500) includes a bonding wire structure (502;700;1100;1200;1300;1400), a damping material (124;516), a plurality of ultrasonic transducers (102,104,106;210;310;410;910), and a printed circuit board (114). The bonding wire structure includes a plurality of bonding wire elements (504,506,508;600). The damping material surrounds the bonding wire structure and is interposed with the plurality of bonding wire elements. The plurality of ultrasonic transducers is arranged in a matrix, each of the plurality of ultrasonic transducers being coupled to a corresponding bonding wire element of the plurality of bonding wire elements. The printed circuit board includes a plurality of circuits. Each of the plurality of circuits is coupled to a corresponding bonding wire element of the plurality of bonding wire elements.