Ultrasonic Transducer Backside Structure for Ring-Down Suppression
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Solution Overview
Problem
Conventional ultrasonic transducers with single-layer piezoelectric materials struggle to effectively restrain ring-down signals, limiting the resolution of ultrasonic waves and image quality.
Innovation Solution
Incorporating a piezoelectric material layer with a protrusion or recess structure on its back side, along with electrode layers, to generate multiple vibration frequencies, which helps restrain ring-down signals and enhance resolution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single-layer piezoelectric material is used in the ultrasonic transducer, then the device structure is simple and easy to manufacture, but the ring-down signals cannot be restrained and the resolution cannot be improved
Solution Approach 1:
The piezoelectric material layer is divided into multiple sub-layers with different thicknesses, creating a segmented structure. This segmentation generates multiple vibration frequencies that work together to restrain ring-down signals while maintaining manufacturing feasibility through standardized layering processes.
Solution Approach 2:
The patent changes the thickness parameters of individual piezoelectric sub-layers to create specific vibration frequency characteristics. By adjusting the thickness of each layer, the transducer generates multiple frequencies that suppress ring-down signals, thereby improving resolution without significantly complicating manufacturing.
2Device complexity
If a single-layer piezoelectric material with half-wavelength thickness is used, then the design is simple, but the electrical waveform is not ideal and ring-down signals cannot be restrained
Solution Approach 1:
The piezoelectric material layer is segmented into multiple sub-layers with different thicknesses. This segmentation creates a multi-frequency vibration response that produces ideal electrical waveforms with suppressed ring-down signals, while the modular structure keeps device complexity manageable.
Solution Approach 2:
The patent uses a composite structure of piezoelectric sub-layers with different thickness characteristics. This composite arrangement generates multiple vibration frequencies that work synergistically to improve electrical waveform quality and restrain ring-down signals without excessive device complexity.
3Measurement precision
If multiple vibration frequencies are generated through protrusion or recess structure, then ring-down signals are restrained and resolution is improved, but the piezoelectric material layer structure becomes more complex
Solution Approach 1:
The patent applies local quality changes by creating protrusion or recess structures at specific locations on the back side of the piezoelectric material layer. These localized structural modifications generate the necessary multiple vibration frequencies to restrain ring-down signals without requiring complex changes to the entire device structure.
Solution Approach 2:
The patent introduces dimensional variation by adding protrusion or recess structures to the back side of the piezoelectric layer, creating thickness variations that generate multiple vibration frequencies. This dimensional approach improves resolution through frequency diversity while maintaining relative structural simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces ring-down signals, thereby improving the resolution and quality of ultrasonic images by generating a range of vibration frequencies.
Implementation Method 1
An ultrasonic transducer is a transducer that realizes the mutual conversion of acoustic energy and electrical energy within the frequency range of ultrasonic waves
Implementation Method 2
When the transducer is in a receiving state, the acoustic energy is converted into the mechanical energy and then into the electrical energy
Data Source
AI summary
An ultrasonic transducer includes a piezoelectric material layer, a first electrode layer, and a second electrode layer. The piezoelectric material layer has an ultrasonic wave emitting side and a back side opposite to the ultrasonic wave emitting side. The piezoelectric material layer has a protrusion structure or a recess structure on the back side. The protrusion structure or the recess structure overlaps a central axis of the piezoelectric material layer. The first electrode layer is disposed on the back side of the piezoelectric material layer. The second electrode layer is disposed on the ultrasonic wave emitting side of the piezoelectric material layer.