Ultrasonic Transducer Stepped Substrate Bonding Control
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Solution Overview
Problem
Existing ultrasonic transducers face challenges in optimizing the frequency and amplitude of ultrasonic acoustic emissions due to limitations in the design of the substrate and electromechanically active devices, which affect the efficiency and performance of ultrasonic transducers in generating high-frequency vibrations.
Innovation Solution
The ultrasonic transducer design incorporates a substrate with a step structure and vias to secure an electromechanically active device, allowing for controlled bonding and varying the resonant free-length, frequency, and amplitude, while a membrane is attached to acoustically couple vibrations to air, enhancing air-coupling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the electromechanically active device is directly bonded to a flat substrate, then the manufacturing process is simple, but the frequency and amplitude of ultrasonic acoustic emissions cannot be optimized
Solution Approach 1:
The substrate is segmented into multiple levels through step structures, creating distinct bonding surfaces at different heights. This segmentation allows the electromechanically active device to be bonded at an optimized position while maintaining manufacturing simplicity through standard PCB fabrication processes.
Solution Approach 2:
The invention transitions from a two-dimensional flat substrate to a three-dimensional stepped substrate structure. By adding the vertical dimension through steps, the design enables precise control over the bonding position and resonant free-length of the electromechanically active device, thereby optimizing frequency and amplitude characteristics.
2Reliability
If the electromechanically active device is secured with extensive bonding, then the structural stability is improved, but the resonant free-length and vibration characteristics are compromised
Solution Approach 1:
The bonding structure is designed with local quality variation through stepped regions. The electromechanically active device is bonded only to specific portions of the substrate at defined step levels, providing sufficient structural stability while preserving the necessary resonant free-length for efficient ultrasonic emission.
3Productivity
If the membrane is placed close to the electromechanically active device, then the acoustic coupling is enhanced, but the risk of interference with device vibration is increased
Solution Approach 1:
The membrane acts as an intermediary element between the electromechanically active device and the air medium. It is positioned and bonded to transfer vibrational energy efficiently to the air while maintaining an appropriate distance from the electromechanically active device to avoid interfering with its vibration characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the frequency, amplitude, and efficiency of ultrasonic acoustic emissions by allowing for precise control over the electromechanically active device's bonding and vibration characteristics, resulting in improved performance and efficiency of ultrasonic transducers.
Implementation Method 1
electromechanically active device may be used to generate soundwaves, including ultrasonic soundwaves through vibration of the electromechanically active device
Implementation Method 2
a membrane is attached to acoustically couple vibrations to air, enhancing air-coupling efficiency
Implementation Method 3
allowing for controlled bonding and varying the resonant free-length, frequency, and amplitude
Data Source
Figure 1~2
Figure 3~4B
Figure 5~6A
AI summary
Systems and techniques are provided for an ultrasonic transducer. A substrate may include a main cavity, a secondary cavity, and a channel. The main cavity may have a greater depth than the secondary cavity. The secondary cavity may have a greater depth than channel. A first step may be formed where the main cavity and the secondary cavity overlap. A second step may be formed where the secondary cavity and the main cavity overlap. An electromechanically active device may be attached to the substrate at the first step and the second step such that a free end of the electromechanically active device is suspended over the main cavity. A membrane section may be bonded to the substrate such that the membrane covers the main cavity and the secondary cavity and is bonded to the free end of the electromechanically active.