Ultrasonic Wave Frequency Optimization for Metallic Microstructure Measurement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing ultrasonic wave measurement methods for metallic microstructures face challenges with excessively high or low frequencies, leading to poor signal-to-noise ratios and insufficient precision in measuring grain sizes, particularly due to equipment-specific frequency distributions and limited frequency resolution.
Innovation Solution
A measuring apparatus utilizing a pulse laser oscillator with a beam splitter and optical paths to generate and detect ultrasonic waves, allowing for specific frequency components to be energized and analyzed, including a laser interferometer to detect and calculate material properties based on ultrasonic waves.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If ultrasonic waves with excessively high frequencies are used, then measurement sensitivity is improved, but signal attenuation due to scattering at crystal grains increases excessively, causing worsened signal-to-noise ratios and debased measurement precision
Solution Approach 1:
The patent changes the frequency parameter of ultrasonic waves from excessively high frequencies to appropriately selected frequencies (typically 1 MHz to 100 MHz) based on grain size. The waveform analyzer extracts specific frequency components from the detected ultrasonic waves, allowing optimization of the frequency parameter to balance measurement sensitivity with acceptable signal attenuation levels.
2Loss of energy
If ultrasonic waves with excessively low frequencies are used, then signal attenuation due to scattering is reduced, but significant attenuation due to diffusion occurs, still constituting a difficulty in the measurement
Solution Approach 1:
The patent selects ultrasonic wave frequencies within the range of 1 MHz to 100 MHz, avoiding excessively low frequencies that cause significant diffusion attenuation. The waveform analyzer further processes the detected signals to extract optimal frequency components, ensuring the frequency parameter is optimized to minimize diffusion attenuation while maintaining measurement capability.
3Reliability
If a Q-switched solid state pulse laser oscillator with typical pulse width is used, then equipment stability and industrial applicability are improved, but frequency resolution is reduced due to short recording time, making it difficult to avoid mixing frequency components
Solution Approach 1:
The waveform analyzer acts as an intermediary between the pulse laser oscillator and the measurement process. It processes the detected ultrasonic wave signals to extract specific frequency components through techniques such as Fourier transform or wavelet transform, effectively improving frequency resolution without requiring changes to the stable pulse laser oscillator.
4Productivity
If pulse ultrasonic waves with very short recording time are recorded, then measurement speed is improved, but frequency resolution is lowered, making it difficult to separate specific frequency components
Solution Approach 1:
The waveform analyzer serves as an intermediary that processes the short-duration pulse ultrasonic wave signals. By applying frequency analysis techniques such as Fourier transform or wavelet transform, it extracts specific frequency components from the limited time-window signals, achieving adequate frequency resolution while maintaining the fast measurement speed enabled by short recording times.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables more precise measurements of metallic microstructures and material properties, particularly grain sizes within a range of several micrometers, by optimizing frequency components and signal quality.
Implementation Method 1
a pulse laser oscillator 11 adapted to output a pulse laser beam 201... when a material to be measured is irradiated with such a pulse laser beam, there appear ultrasonic waves energized
Implementation Method 2
a laser interferometer 33 adapted to irradiate the measuring material 100 with light of a second laser beam 211, and have light intensity variations resulted from interferences between reference light and light of the second laser beam 211 reflected or scattered from the measuring material 100, as bases to detect ultrasonic waves
Data Source
AI summary
A pulse laser oscillator (11) outputs a first laser beam, a beam splitter splitting the first laser beam into split beams, optical paths (12, 13, 14, 15, 16) propagating light of split beams split, respectively, taking different times for light propagation thereof, a condenser superimposing light of split beams propagated through the optical paths, respectively, on an identical spot of a measuring material (100), for irradiation therewith, a laser interferometer (30) irradiating the measuring material (100) with light of a second laser beam, having light intensity variations resulted from interferences between reference light and light of the second laser beam reflected or scattered, as bases to detect ultrasonic waves energized by light of the first laser beam and transmitted in the measuring material (100), a waveform analyzer (32) calculating a metallic microstructure or a material property of the measuring material (100) based on ultrasonic waves.