Ultrasonic Wire Defect Imaging for Fast Semiconductor Inspection
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Solution Overview
Problem
Existing defect detection methods for wires connecting semiconductor chips and substrates are inaccurate and time-consuming, particularly for semiconductor chips with numerous wires, leading to potential erroneous detection and prolonged inspection times.
Innovation Solution
An ultrasound vibrating-type defect detection apparatus that includes an ultrasound vibrating device, a power supply, an imaging device, and a controller to vary high-frequency power frequency, adjusting voltage to ensure target portion amplitudes are greater than non-target portions, using feedback control to maintain current within a predetermined range, and calculating image differences to detect defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If electrical means or mechanical means are used for defect detection, then detection can be performed, but erroneous detection occurs and accuracy is reduced
Solution Approach 1:
The patent replaces electrical means and mechanical means with ultrasonic vibration-based optical detection. The inspection object is ultrasonically vibrated and imaged by an imaging device, substituting traditional electrical/mechanical detection systems with a physics-based vibration imaging system that avoids erroneous detection while maintaining high accuracy.
Solution Approach 2:
The patent applies mechanical vibration by ultrasonically vibrating the inspection object to enable defect detection through imaging. The ultrasonic vibration causes the inspection object to vibrate, and defects are detected by capturing and analyzing images of these vibrations, providing both high accuracy and reliability.
2Measurement precision
If defect detection is performed for each wire individually, then detection accuracy can be maintained, but inspection time increases significantly for semiconductor chips with more than 100 wires
Solution Approach 1:
The patent merges the detection of multiple wires into a single simultaneous inspection process. By ultrasonically vibrating the entire inspection object and capturing images with an imaging device, all wires are detected at once rather than individually, dramatically reducing inspection time while maintaining detection accuracy through image analysis.
Solution Approach 2:
The ultrasonic vibration and imaging system serves as a universal detection method that can inspect multiple wires simultaneously across different locations and configurations. The system is not limited to individual wire detection but can handle complex multi-wire arrangements in semiconductor chips with 100+ wires efficiently.
3Measurement precision
If frequency of high-frequency power is varied to improve detection accuracy, then detection precision improves, but system complexity increases
Solution Approach 1:
The patent changes the frequency parameter of the high-frequency power supplied to the ultrasonic vibrator to optimize detection accuracy. By varying the frequency and adjusting the voltage accordingly to maintain current within a predetermined range, the system achieves high detection precision while the controller manages the parameter changes automatically.
Solution Approach 2:
The patent implements feedback control by monitoring the current of the high-frequency power and adjusting the voltage to maintain current within a predetermined range. This feedback mechanism simplifies the control system by automatically managing frequency and voltage adjustments, eliminating the need for complex manual control while maintaining detection accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus enables high-accuracy defect detection in a short time by preventing non-target portions from obscuring target portions and allowing precise amplitude detection, even with varying frequencies, thus improving detection efficiency.
Implementation Method 1
an ultrasound vibrating device ultrasonically vibrating the inspection object
Implementation Method 2
an imaging device imaging the inspection object ultrasonically vibrated
Data Source
AI summary
An ultrasound vibrating-type defect detection apparatus (100) for detecting a defect in a semiconductor apparatus (10) is provided with: an ultrasound vibrator (42); a high-frequency power supply (40); a camera (45); and a controller (50) for adjusting the frequency of high-frequency power supplied from the high-frequency power supply (40) to the ultrasound vibrator (42), and for performing detection of a defect in the semiconductor apparatus (10). The controller (50) causes the camera (45) to capture an image of the semiconductor apparatus (10) while varying the frequency of high-frequency power supplied from the high-frequency power supply (40) to the ultrasound vibrator (42), and performs detection of a defect in the semiconductor apparatus (10) on the basis of the captured image.