Ultrasonic Wire Embedding in 3D Structures Before Insert Molding
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Solution Overview
Problem
Conventional methods for manufacturing three-dimensional structures face issues with undesirable displacement of conductive wires during the insert-molding process, particularly when molten plastic is used to form the rear substrate, which can disrupt the position and functionality of the heater components.
Innovation Solution
A method involving the partial embedding of conductive wires into a plastic layer using ultrasonic waves to secure them in place before the insert-molding of the rear substrate, reducing the likelihood of displacement and ensuring accurate positioning within the three-dimensional structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the rear substrate is insert-molded using molten plastic material, then the rear substrate can be formed and joined to the front substrate, but the molten plastic material may press and cause undesirable displacement of the heater components
Solution Approach 1:
The heater components are fixed to the front substrate before the insert-molding process begins. This preliminary fixing action ensures that when molten plastic material is later injected to form the rear substrate, the heater components are already secured and will not be displaced by the pressing force of the molten plastic.
2Device complexity
If the heater components are left unsecured during insert-molding, then the manufacturing process is simpler, but the heater components may be displaced by the molten plastic material
Solution Approach 1:
The heater components are fixed to the front substrate before the insert-molding process begins. This preliminary fixing action ensures that when molten plastic material is later injected to form the rear substrate, the heater components are already secured and will not be displaced by the pressing force of the molten plastic.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively minimizes the risk of conductive wire displacement during the manufacturing process, maintaining the structural integrity and functionality of the three-dimensional structure, particularly in applications like vehicle components and millimeter wave radar devices.
Implementation Method 1
operating an ultrasonic head to apply ultrasonic waves to the conductive wire and to press the conductive wire against the plastic layer
Data Source
AI summary
A method for manufacturing a three-dimensional structure including: preparing a first structure including a fixing face; fixing a plastic layer to the fixing face of the first structure; preparing a conductive wire; and operating an ultrasonic head to apply ultrasonic waves to the conductive wire and to press the conductive wire against the plastic layer, and thereby partly embedding the conductive wire into the plastic layer.