Ultrasonic Bonding Wire Guide Structure for Torsion-Free Positioning
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The wire guiding module in ultrasonic bonding devices causes deformation and twisting of bonding wires during movement, leading to inaccurate positioning under the tool, which can result in failed bonds.
Innovation Solution
The ultrasonic bonding device incorporates a second wire guiding module with an elongated guide channel and guide rollers to ensure the bonding wire exits torsion-free, positioned under the tool, and a monolithic module body for cost-effective manufacturing and reduced wear.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the bonding head is moved in multiple axes and rotated during bonding operations, then the bonding device can access different positions and orientations for bonding, but the bonding wire becomes deformed and twisted during movement
Solution Approach 1:
The wire guiding module is divided into multiple segments including a first wire guiding module associated with the tool and a second wire guiding module between the wire feed and the first module. This segmentation allows each module to independently manage wire guidance at different stages, reducing cumulative deformation effects while maintaining overall system versatility.
Solution Approach 2:
A holder is introduced as an intermediary component on the bonding head to fix the wire feed end facing the second wire guiding module. This intermediary structure provides a stable reference point that prevents wire feed deformation during bonding head movement, thereby maintaining wire geometry stability while allowing full movement capability.
2Device complexity
If a single wire guiding module is used, then the device structure is simpler, but the wire cannot be reliably guided under the tool without deformation
Solution Approach 1:
The wire guiding function is segmented into two distinct modules: the first wire guiding module positioned at the tool and the second wire guiding module positioned between the wire feed and first module. This segmentation enables more reliable wire guidance by distributing the guidance function across multiple specialized components, improving positioning accuracy despite increased structural complexity.
Solution Approach 2:
The holder serves as an intermediary structure that connects the wire feed to the second wire guiding module on the bonding head. This intermediary component ensures stable wire feed positioning and prevents deformation, thereby significantly improving wire positioning reliability and bonding accuracy.
3Ease of operation
If the wire feed is not fixed on the bonding head, then the bonding head can move freely, but the wire exits the wire guiding module in a geometrically indeterminate manner
Solution Approach 1:
The wire guiding system is segmented into multiple modules with the holder providing a fixed reference point on the bonding head. This segmentation allows the bonding head to move freely for ease of operation while the segmented wire guiding modules maintain precise wire positioning relative to each other, ensuring deterministic wire exit position.
Solution Approach 2:
The holder acts as an intermediary fixed structure on the bonding head that anchors the wire feed end. This intermediary component provides a stable reference frame that maintains precise wire exit positioning from the first wire guiding module under the tool, even when the bonding head moves freely in space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces the risk of wire misalignment and extends the service life of the bonding device by maintaining wire integrity and minimizing wear, ensuring reliable bonding operations.
Implementation Method 1
a transducer module configured to excite the tool to produce ultrasonic vibrations
Implementation Method 2
an elongated guide channel for the bonding wire, the second guide channel having an inlet opening and an outlet opening
Data Source
AI summary
An ultrasonic bonding device includes a bonding head movable and/or positionable in a movement axis and rotatable and/or positionable about a rotational axis. The bonding head has a tool for ultrasonically bonding a bonding wire and a transducer module for exciting the tool to produce ultrasonic vibrations. The ultrasonic bonding device further includes: a stationary wire supply for the bonding wire; an elongated wire feed that is cylindrical in cross-section; a first wire guiding module having an inlet and outlet opening for the bonding wire, and being associated with the tool such that bonding wire emerging from the outlet opening is guided under the tool; and a second wire guiding module having an elongated guide channel for the bonding wire, the second guide channel having an inlet and outlet opening, the second wire guiding module being provided between the wire feed and the first wire guiding module.