Ultrasonic Device Wiring Substrate Opening for Signal Integrity
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Solution Overview
Problem
The use of relay substrates like FPCs in ultrasonic devices leads to voltage drops and noise introduction due to wiring resistance and external noise interference, affecting signal quality in ultrasonic diagnostic devices.
Innovation Solution
An ultrasonic device design featuring an element substrate with ultrasonic elements and a wiring substrate having an opening portion, where an acoustic matching layer and acoustic lens are used to enhance signal transmission and reception, with a sealing member to prevent moisture ingress and improve connection reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a relay substrate such as an FPC is used to electrically connect the wiring substrate and the ultrasonic transducer element chip, then electrical connection is achieved, but voltage drop occurs due to wiring resistance and connection resistance of the relay substrate
Solution Approach 1:
The patent removes the relay substrate (FPC) from the system by establishing direct electrical connection between the wiring substrate and ultrasonic transducer element chip through through-holes. This extraction eliminates the source of voltage drop and connection resistance, resolving the contradiction between achieving electrical connection and minimizing energy loss.
Solution Approach 2:
The patent merges the wiring substrate and ultrasonic transducer element chip into a single integrated structure where electrical connections are made directly through the substrate thickness. This consolidation eliminates the intermediate relay substrate, reducing the number of connection interfaces and minimizing both wiring resistance and connection resistance simultaneously.
2Reliability
If a relay substrate such as an FPC is used to electrically connect the wiring substrate and the ultrasonic transducer element chip, then electrical connection is achieved, but noise is introduced into the relay substrate from the outside
Solution Approach 1:
The patent extracts and removes the relay substrate (FPC) that acts as an antenna for external noise. By eliminating this intermediate component, the system reduces its exposure to electromagnetic interference and external noise, thereby improving signal quality without compromising electrical connection functionality.
Solution Approach 2:
The patent introduces a different type of intermediary structure - through-holes with conductive plugs - that serve as electrical connectors without acting as noise antennas. This alternative mediator provides the necessary electrical connection while minimizing harmful electromagnetic interference, resolving the contradiction between connection and noise resistance.
3Length of moving object
If the wiring substrate is made thinner to reduce device size, then device compactness is improved, but the structural strength and sealing capability are reduced
Solution Approach 1:
The patent applies local reinforcement by adding protrusions on the rear surface of the wiring substrate at specific locations corresponding to the through-holes. This localized structural enhancement provides mechanical strength and sealing capability exactly where needed (at the connection points) without increasing the overall thickness of the wiring substrate, thus resolving the contradiction between compactness and strength.
Solution Approach 2:
The patent incorporates sealing members and protrusions during the manufacturing process before final assembly. These features are pre-formed on the wiring substrate to provide both structural reinforcement and sealing capability, ensuring that the thin substrate maintains adequate strength without requiring post-manufacturing thickening or additional support structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces signal attenuation and noise interference, enhances connection reliability, and allows for efficient ultrasonic wave transmission and reception, resulting in a thinner and more reliable ultrasonic device.
Implementation Method 1
an acoustic matching layer and an acoustic lens that are stacked in order in the opening of the opening portion from a side of the element substrate
Implementation Method 2
an acoustic matching layer and an acoustic lens that are stacked in order in the opening of the opening portion from a side of the element substrate
Implementation Method 3
a sealing member packed into a gap between the opening portion and the acoustic lens
Implementation Method 4
an element substrate including an ultrasonic element and an element interconnect terminal connected to the ultrasonic element
Data Source
AI summary
An ultrasonic device includes an element substrate and a wiring substrate. The element substrate includes an ultrasonic element and an element interconnect terminal connected to the ultrasonic element. The wiring substrate includes a wiring terminal and an opening portion that defines an opening extending through the wiring substrate. The element interconnect terminal and the wiring terminal are connected so as to oppose each other. The opening portion encloses the ultrasonic element in plan view as seen from a thickness direction of the wiring substrate.