Ultrasound Die Stack with Split TX/RX ASICs for Lower Power
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Solution Overview
Problem
Conventional ultrasound systems are large, complex, and expensive, limiting their accessibility to large medical facilities, while existing monolithic ultrasound devices face challenges in efficiently integrating analog and digital circuitry due to differing voltage and technology node requirements.
Innovation Solution
Implementing integrated transmit and receive circuitry in separate devices, with the transmit circuitry operating at higher voltages in a more advanced technology node and the receive circuitry operating at lower voltages in a less advanced node, connected via through-silicon vias and high-speed communication links, allowing for a three-die stack configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If transmit circuitry and receive circuitry are integrated in the same device, then device complexity is reduced, but power consumption increases due to conflicting voltage requirements
Solution Approach 1:
The ultrasound device is divided into separate transmit and receive devices, each optimized for their specific voltage requirements. The transmit device operates at higher voltages (e.g., 5-10V) while the receive device operates at lower voltages (e.g., 1.8-3.3V), eliminating the need for the receive device to handle high voltage swings and thereby reducing overall power consumption.
Solution Approach 2:
Each device is designed with local optimization for its specific function. The transmit device uses technology nodes and voltage levels optimized for high-power transmission, while the receive device uses technology nodes optimized for low-power signal reception. This local quality approach allows each component to operate at peak efficiency for its specific role.
2Stress or pressure
If transmit circuitry operates at higher voltages in advanced technology node, then acoustic signal pressure is improved, but manufacturing complexity increases
Solution Approach 1:
The system is segmented into transmit and receive devices that can be manufactured separately using different technology nodes. The transmit device can be fabricated in an advanced technology node (e.g., 65nm or smaller) to achieve high acoustic signal pressure, while the receive device can be manufactured in a less advanced node, allowing each to be optimized independently for its specific performance requirements.
Solution Approach 2:
The invention changes the voltage and technology node parameters differently for transmit and receive devices. The transmit device uses higher voltages and advanced technology nodes to maximize acoustic pressure output, while the receive device uses lower voltages and potentially less advanced nodes, optimizing the overall system performance while managing manufacturing complexity.
3Use of energy by moving object
If receive circuitry operates at lower voltages in less advanced node, then power consumption is reduced, but data processing capability is limited
Solution Approach 1:
High-speed communication links and through-silicon vias act as intermediaries between the receive device and the imaging system. These high-bandwidth interfaces enable the receive device to offload processed data efficiently, compensating for its lower local processing capability by maintaining high data throughput to external processing resources.
Solution Approach 2:
The architecture moves processing capability to another dimension by separating the low-power signal reception function from the high-power data processing function. The receive device focuses on efficient signal acquisition at low power, while data processing is handled by external systems or the transmit device, which has greater processing resources available.
4Use of energy by moving object
If separate devices are used for transmit and receive circuitry, then power management is improved, but device complexity increases
Solution Approach 1:
The patent replaces complex voltage management mechanisms within a single device with a simpler inter-device communication architecture. Through-silicon vias and high-speed communication links provide straightforward electrical connections between the transmit and receive devices, eliminating the need for complex voltage switching and isolation circuitry that would be required in an integrated design.
Data Source
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AI summary
Aspects of the technology described herein relate to an ultrasound device including a first die that includes an ultrasonic transducer, a first application- specific integrated circuit (ASIC) that is bonded to the first die and includes a pulser, and a second ASIC in communication with the second ASIC that includes integrated digital receive circuitry. In some embodiments, the first ASIC may be bonded to the second ASIC and the second ASIC may include analog processing circuitry and an analog-to-digital converter. In such embodiments, the second ASIC may include a through-silicon via (TSV) facilitating communication between the first ASIC and the second ASIC. In some embodiments, SERDES circuitry facilitates communication between the first ASIC and the second ASIC and the first ASIC includes analog processing circuitry and an analog-to-digital converter. In some embodiments, the technology node of the first ASIC is different from the technology node of the second ASIC.