Ultra-Thin Multilayer PCB Laminate for Durability During Peeling
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Solution Overview
Problem
Multilayered printed circuit boards face limitations in achieving both thin thickness and durability due to the use of prepregs, which restrict thickness reduction and increase brittleness when fiber reinforcement is removed, making them prone to damage during detachment.
Innovation Solution
A multilayered printed circuit board with a resin laminate having insulation and metal patterns, where the insulation pattern thickness is 15 μm or less, and a resist pattern layer on the surfaces, manufactured using a method involving laminating metal and insulating layers on a carrier film, followed by peeling and re-laminating with a resist layer to enhance durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If prepreg is used as insulating material, then structural strength is improved, but thickness reduction is limited
Solution Approach 1:
The invention extracts and removes the fiber reinforcement component from the traditional prepreg structure, retaining only the polymer resin film. This extraction allows the insulating material to achieve much thinner thickness (15 μm or less) while maintaining its primary function of electrical insulation, resolving the contradiction between structural strength and thickness reduction.
Solution Approach 2:
The invention changes the physical and chemical parameters of the insulating material by using a polymer resin film with controlled thickness (15 μm or less) and specific mechanical properties. This parameter change enables the material to provide sufficient insulation while being thin enough to meet the thickness reduction requirements of modern electronic devices.
2Length of stationary object
If fiber reinforcement is removed from prepreg, then thickness is reduced, but brittleness increases and durability worsens
Solution Approach 1:
The invention carefully controls the parameters of the polymer resin film, specifically its thickness (15 μm or less) and mechanical properties. By optimizing these parameters, the resin film achieves the right balance between being thin enough for reduced overall thickness and having sufficient flexibility and strength to avoid brittleness and damage during manufacturing processes.
3Length of stationary object
If insulation pattern thickness is reduced to 15 μm or less, then overall board thickness is reduced, but manufacturing complexity increases
Solution Approach 1:
The invention applies a resist pattern layer on the surfaces of the resin laminate before final manufacturing steps. This preliminary action protects the thin insulation patterns (15 μm or less) from damage during subsequent processing and detachment operations, simplifying the overall manufacturing process despite the reduced thickness.
Solution Approach 2:
The resist pattern layer serves as a protective cushion that prevents damage to the ultra-thin insulation patterns during manufacturing. This beforehand protection measures ensures that the delicate thin structures survive the manufacturing process without requiring complex handling procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for the production of ultra-thin multilayer printed circuit boards with improved durability, preventing breakage during manufacturing and enabling the use in thinned and highly integrated semiconductor devices.
Implementation Method 1
a resist pattern layer formed on upper and lower surfaces of the resin laminate
Implementation Method 2
laminating a first metal layer on a surface of a carrier film, and laminating a second metal layer on an opposing surface of the carrier film
Data Source
AI summary
The present invention relates to a multilayered printed circuit board having excellent durability while having a thin thickness, a method for manufacturing the same, and a semiconductor device using the same.