Ultrathin SST Die Structure With Integrated Growth Support
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Solution Overview
Problem
The existing methods for manufacturing solid state transducer (SST) dies, such as LEDs, are costly and inefficient due to the complete removal of the growth substrate, which adds time and material costs, and the use of thick support substrates that increase device thickness and production costs.
Innovation Solution
The use of engineered growth substrates that also serve as permanent support structures, eliminating the need for a separate support substrate and reducing material and processing costs, while maintaining the optical and electrical properties of the SST die.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the growth substrate is completely removed to improve optical properties, then light emission is improved, but manufacturing cost and processing time increase
Solution Approach 1:
The patent combines the growth substrate and support substrate into a single integrated substrate that serves both functions: supporting the epitaxial layers during growth and providing optical transparency for light emission. This eliminates the need to completely remove the substrate after growth, resolving the contradiction between improving light emission and maintaining manufacturing efficiency.
2Strength
If a separate support substrate is attached to support the epitaxial layers, then structural support is improved, but device thickness and material cost increase
Solution Approach 1:
The patent merges the support function into the growth substrate itself by engineering the substrate to have both mechanical strength for supporting delicate epitaxial layers and optical transparency for light emission. This eliminates the need for a separate thick support substrate, reducing overall device thickness while maintaining structural integrity.
Solution Approach 2:
The engineered substrate performs multiple functions simultaneously: it serves as the growth platform for epitaxial layers, provides mechanical support, and enables optical transmission. This multi-functionality eliminates the need for separate support substrates and reduces device complexity.
3Illumination intensity
If the growth substrate is completely removed, then optical properties are improved, but material cost and processing complexity increase
Solution Approach 1:
The patent merges the growth and support functions into a single substrate, eliminating the complex process of attaching a separate support substrate and completely removing the original growth substrate. The integrated substrate remains in place, providing both mechanical support and optical transparency, thereby simplifying the manufacturing process.
Solution Approach 2:
The engineered substrate is designed to perform multiple functions: supporting epitaxial growth and enabling light emission. This multi-functionality eliminates the need for separate support substrates and complex bonding/removal processes, reducing manufacturing complexity while maintaining optical performance.
Data Source
AI summary
Various embodiments of SST dies and solid state lighting (“SSL”) devices with SST dies, assemblies, and methods of manufacturing are described herein. In one embodiment, a SST die includes a substrate material, a first semiconductor material and a second semiconductor material on the substrate material, an active region between the first semiconductor material and the second semiconductor material, and a support structure defined by the substrate material. In some embodiments, the support structure has an opening that is vertically aligned with the active region.