Partially Uncured Component Carrier Interconnection
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Solution Overview
Problem
Conventionally manufactured component carriers tend to crack under excessive thermal or mechanical load, deteriorating their performance.
Innovation Solution
A method of manufacturing a component carrier by interconnecting two component carrier bodies with at least partially uncured material, which is cured through temperature-induced and pressure-induced bidirectional material migration, eliminating the need for additional connecting materials and ensuring a robust, crack-resistant structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional manufacturing methods are used to produce component carriers, then production is simpler and faster, but the component carriers tend to crack under excessive thermal or mechanical load
Solution Approach 1:
The recess is formed in the component carrier body before the final curing process, allowing the uncured material to be molded into the recess and interconnect with the embedded component. This preliminary structuring enables the interconnection to occur during curing rather than requiring separate complex assembly steps afterward.
Solution Approach 2:
The patent utilizes the curing process as a transformative parameter change, where the uncured material transitions from a moldable state to a rigid, crack-resistant state. By performing the interconnection during this phase transition, the method achieves strong bonding without requiring additional complex manufacturing steps.
2Strength
If additional connecting materials are used to interconnect component carrier bodies, then the connection strength is improved, but the risk of delamination and cracking increases
Solution Approach 1:
The patent merges the interconnection function with the component carrier material itself. The uncured material serves dual purposes: as the structural matrix of the component carrier and as the bonding medium for interconnecting the embedded component. This eliminates the need for separate connecting materials that could cause delamination.
Solution Approach 2:
The uncured material performs the self-service function of both structuring the component carrier and bonding the embedded component. During the curing process, the material hardens and simultaneously creates the interconnection, eliminating the need for external connecting materials and reducing delamination risks.
3Stability of the object's composition
If fully cured material is used for component carrier bodies, then structural stability is improved, but the ability to form strong interconnections with embedded components is reduced
Solution Approach 1:
The recess is formed and the embedded component is positioned while the material is still uncured, allowing the uncured material to flow into and around the component. This preliminary arrangement enables strong interconnection before the material hardens and provides structural stability.
Solution Approach 2:
The patent utilizes the dynamic state of uncured material to achieve interconnection, then transitions to the static, stable state of cured material. The uncured material's fluidity allows it to adapt to the embedded component's shape and form strong bonds, while the final cured state provides structural stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in a component carrier that is mechanically robust, resistant to cracking and delamination, and allows for the integration of electronic components without warpage, while enabling the combination of different technological architectures without risk of crack formation.
Implementation Method 1
interconnecting the first component carrier body with the second component carrier body by curing the at least partially uncured material at least in a connection region between the first component carrier body and the second component carrier body
Implementation Method 2
interconnecting the first component carrier body with the second component carrier body by curing the at least partially uncured material at least in a connection region between the first component carrier body and the second component carrier body
Implementation Method 3
providing at least a part of the first component carrier body and the second component carrier body of an at least partially uncured material; interconnecting the first component carrier body with the second component carrier body by curing the at least partially uncured material
Data Source
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AI summary
A method of manufacturing a component carrier (500), wherein the method comprises providing a first component carrier body (100) comprising at least one first electrically insulating layer structure (102) and at least one first electrically conductive layer structure (104), providing a second component carrier body (200) comprising at least one second electrically insulating layer structure (202) and at least one second electrically conductive layer structure (204), providing at least a part of at least one of the first component carrier body (100) and the second component carrier body (200) of an at least partially uncured material, and interconnecting the first component carrier body (100) with the second component carrier body (200) by curing the at least partially uncured material.