Under-Bump Protection Patterns for Corrosion-Resistant Chip Packaging
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Solution Overview
Problem
Existing semiconductor packages face challenges in achieving high reliability and durability due to issues such as corrosion, leakage current, and short circuits, particularly at the under-bump regions, which affect the integrity and performance of the package.
Innovation Solution
The implementation of under-bump protection patterns with a closed loop shape and under-bump patterns, spaced apart from each other, along with a protection layer and seed layers, to enhance structural integrity and prevent corrosion and short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional semiconductor packaging is used without under-bump protection patterns, then the manufacturing process is simpler, but corrosion and short circuits occur at under-bump regions reducing reliability
Solution Approach 1:
The protection structure is segmented into multiple functional layers: protection layer (covering redistribution patterns), under-bump protection patterns (spaced apart structures at under-bump regions), and under-bump patterns (electrical connection structures). This segmentation allows each layer to perform its specific function - the protection layer shields against environmental corrosion, the under-bump protection patterns provide localized protection at critical regions, and the under-bump patterns maintain electrical connectivity, thereby improving reliability without requiring a complete redesign of the packaging structure.
Solution Approach 2:
The under-bump protection patterns act as intermediary structures between the redistribution patterns and the solder balls. These spaced-apart protection patterns are positioned at the under-bump regions to prevent direct contact between corrosive environments and the bump structures, while still allowing the under-bump patterns to provide electrical connection. This intermediary protection layer resolves the contradiction by adding reliability-enhancing structures without completely redesigning the electrical connection path.
2Reliability
If under-bump protection patterns are added to prevent corrosion and short circuits, then reliability improves, but manufacturing complexity increases
Solution Approach 1:
The protection layer is formed in advance to cover the redistribution patterns before the under-bump protection patterns are created. This preliminary protection layer prevents corrosion during subsequent manufacturing steps and establishes a stable base for adding the under-bump protection patterns. By performing the protection layer formation first, the manufacturing process is organized in a logical sequence that improves durability while managing complexity through structured process planning.
Solution Approach 2:
The under-bump protection patterns are applied specifically at the under-bump regions where corrosion and short circuits are most likely to occur, rather than uniformly across the entire package. This localized approach provides targeted protection at critical vulnerability points while minimizing the overall addition of manufacturing steps. The spaced-apart configuration of under-bump protection patterns ensures protection where needed without unnecessarily complicating the entire manufacturing process.
3Reliability
If under-bump protection patterns with closed loop shape are used, then protection against short circuits is enhanced, but the device structure becomes more complex
Solution Approach 1:
The electrical connection system is segmented into distinct functional elements: under-bump protection patterns with closed loop shapes for protection, and under-bump patterns for electrical connection. The closed loop shape of the under-bump protection patterns creates isolated protective zones that prevent short circuits between adjacent bumps while maintaining clear separation between protection functions and connection functions. This segmentation enhances electrical connection integrity by preventing leakage current paths while keeping the pattern geometry manageable through functional separation.
Data Source
AI summary
A method of manufacturing a semiconductor package may include providing a semiconductor chip, forming redistribution patterns, which are provided on a top surface of the semiconductor chip and are electrically connected to the semiconductor chip, forming a protection layer to cover top surfaces of the redistribution patterns, forming under-bump protection patterns on the protection layer, and forming under-bump patterns, which are provided on the protection layer and are electrically connected to the redistribution patterns. The under-bump protection patterns may be spaced apart from each other.