Under-Chip Bridge Layout for Dense SiP Interconnects
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Solution Overview
Problem
Existing semiconductor packages face challenges with high-density interconnects due to the use of interposers or embedded bridges, which increase size, complexity, and manufacturing difficulties, including material loss and reliability issues.
Innovation Solution
The implementation of an under chip bridge (UCB) system-in-package (SiP) that connects dies directly to a substrate without a trench, using a flat bridge with uniform thickness and smaller interconnects, allowing for improved manufacturing processes and higher density connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If an interposer is used to distribute high density interconnections between dies, then the interconnect density is improved, but the SiP size increases and routing complexity increases
Solution Approach 1:
The invention extracts the bridge structure from the substrate and places it directly under the dies, eliminating the need for a large interposer. The bridge carries only the necessary high-density interconnections between dies, while the substrate maintains its original flat structure for other connections, thus achieving high interconnect density without increasing overall SiP size.
Solution Approach 2:
The invention segments the interconnection function by separating the high-density die-to-die connections (handled by the bridge) from the die-to-substrate connections (handled by the flat substrate). This segmentation allows each component to be optimized independently, with the bridge providing dense interconnects and the substrate providing a stable mounting platform.
2Quantity of substance
If an interposer is used to distribute high density interconnections, then the interconnect density is improved, but the routing complexity increases
Solution Approach 1:
The bridge structure is extracted and positioned directly under the dies, carrying only the necessary high-density signals between dies. This eliminates the complex routing requirements of a full interposer, as the bridge serves a focused function and the substrate handles remaining connections in a simpler manner.
3Ease of manufacture
If a trough is created in the substrate to embed the bridge, then the bridge can be embedded, but manufacturing complexity increases and material loss occurs
Solution Approach 1:
Instead of creating a trough in the substrate to accommodate the bridge, the invention inverts the approach by placing the bridge on top of the flat substrate. The bridge is positioned and connected to dies, then the space around it is filled with underfill material, eliminating the need for substrate removal and associated material loss.
4Ease of manufacture
If a deep trough is created to embed the bridge, then the bridge can be embedded, but substrate warping and damage occur
Solution Approach 1:
The invention inverts the traditional embedding approach by placing the bridge above the substrate plane rather than cutting a deep trough. The bridge is supported by underfill material that fills the space between the bridge and substrate, eliminating the mechanical stress and warping caused by deep substrate trenches while maintaining reliable bridge connections.
5Ease of operation
If multiple sizes of solder bumps are used to connect dies and bridge to substrate, then the connections can be made, but manufacturing complexity increases
Solution Approach 1:
The invention inverts the traditional approach by positioning the bridge above the substrate rather than embedding it in a trough. This allows all connections (die-to-bridge and bridge-to-substrate) to be made with the same solder bump size, eliminating the need for multiple bump sizes and simplifying the manufacturing process while maintaining full connection capability.
Data Source
AI summary
Systems, apparatuses, semiconductor products and methods for semiconductor packages, specifically under chip bridge system-in-packages, are provided that allow one or more bridges to connect two or more dies. For example, high density connections of two or more dies may be connected with an under chip bridge, all of which may be placed on a substrate to form a system-in-package semiconductor package. Various embodiments include methods of manufacturing such packages that include utilizing a flat semiconductor along with bumping operations that may use single sizes of bumping.