Under-Display Fingerprint Sensing Layout for Narrow-Bezel Screens

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Solution Overview

Problem

Existing electronic devices with identity recognition features, such as fingerprint sensing, require openings in the peripheral region for sensing modules, leading to a reduction in the screen-to-body ratio.

Innovation Solution

An electronic device design that includes an insulating substrate with via holes, a light-emitting unit, and a photosensor, where the light-emitting unit and photosensor are positioned without overlapping with an insulating layer, allowing for identity recognition without reducing the screen-to-body ratio.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If an opening is formed in the peripheral region to accommodate a sensing module for identity recognition, then identity recognition function is provided, but the screen-to-body ratio is reduced

Engineering Contradiction:
Improveidentity recognition functionVSAvoidscreen-to-body ratio
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The sensing module is relocated from the peripheral region (2D plane) to the display area by utilizing the light-emitting unit's optical path. The photosensor is positioned in the display area and detects light reflected from the finger placed on the display surface, effectively using the display area for both display and sensing functions.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The display area serves dual purposes: it functions as both the display screen and the sensing area for fingerprint recognition. The light-emitting unit and photosensor work together to enable identity recognition without requiring a separate peripheral opening, making the display area multi-functional.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Device complexity

If the photosensor is disposed below the insulating layer, then the structure is simplified, but the photosensor cannot effectively receive light from the light-emitting unit

Engineering Contradiction:
Improvestructure complexityVSAvoidlight reception effectiveness
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The insulating layer is selectively removed or not formed only in the region where the photosensor is disposed, creating a local variation in the layer structure. This allows light to reach the photosensor effectively while maintaining the insulating layer in other regions for electrical isolation and structural integrity.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The via hole serves as an intermediary structure that allows light to pass through the insulating substrate to reach the photosensor. The via hole acts as a light transmission channel, enabling effective light reception while maintaining the overall layered structure of the device.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enables identity recognition without the need for peripheral openings, thereby maintaining a higher screen-to-body ratio and allowing for a narrower frame or frameless design.

Implementation Method 1

a light-emitting unit, wherein the light-emitting unit is not overlapped with the insulating layer

Methodology Applied
Scientific EffectLight emission: Light Emitting Diode

Implementation Method 2

a photosensor overlapped with the second via hole, wherein the photosensor is electrically connected to the second connecting element

Methodology Applied
Scientific EffectPhotoelectric detection: Photoelectric Effect

Data Source

PatentUS20250029420A1Electronic device
Publication Date: 2025.01.23 INNOLUX CORP
  • US20250029420A1 patent drawing
  • US20250029420A1 patent drawing
  • US20250029420A1 patent drawing

AI summary

An electronic device includes an insulating substrate, an insulating layer, a first connecting element and a second connecting element. The insulating substrate includes a first via hole and a second via hole. The light-emitting unit is disposed on the insulating substrate. The insulating layer is disposed on the insulating substrate, wherein the light-emitting unit is not overlapped with the insulating layer. The first connecting element is electrically connected to and overlapped with the light-emitting unit, wherein the first connecting element is disposed in the first via hole of the insulating substrate. The second connecting element is electrically connected to and overlapped with the light-emitting unit, wherein the second connecting element is disposed in the second via hole of the insulating substrate.