Under-Display Module Layout for Thinner High-Transmittance Panels
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Solution Overview
Problem
Existing electronic devices face challenges in thinning while maintaining improved performance of sensors and cameras, and their manufacturing processes are complex and costly.
Innovation Solution
The electronic device design includes a display panel with defined high and low transmittance areas, an electronic module positioned below the high transmittance area, and an intermediate layer such as an optically clear resin or anisotropic conductive film between the module and the panel, allowing non-overlapping placement and simplified manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the electronic module is disposed below the display panel with overlapping arrangement, then the device can achieve compact structure, but the device thickness increases and manufacturing complexity increases
Solution Approach 1:
The patent transitions from a traditional vertical stacking arrangement (where the electronic module overlaps the display panel in the thickness direction) to a planar arrangement (where the electronic module is disposed beside the display panel in the same plane). This dimensional reorganization eliminates the need for complex multi-layer stacking while maintaining compact form factor, thereby reducing device thickness without increasing manufacturing complexity.
Solution Approach 2:
The patent divides the device structure into distinct functional zones: the display panel occupies one region while the electronic module is separated and disposed in an adjacent region. This segmentation allows each component to be optimized independently and simplifies the manufacturing process by eliminating the need for precise vertical alignment and overlapping assembly.
2Device complexity
If the electronic module is disposed below the first display area, then the structure is simplified, but the sensor and camera performance deteriorates due to lower transmittance
Solution Approach 1:
The patent applies local quality by creating a high transmittance zone (second display area) with optimized optical properties specifically beneath the electronic module. This localized optimization ensures that light can effectively pass through to the sensor and camera components, maintaining high performance while keeping the overall structure simple. The rest of the display panel maintains its normal structure, so the local modification does not compromise overall device complexity.
3Ease of manufacture
If traditional manufacturing processes are used with overlapping components, then assembly is straightforward, but manufacturing time and cost increase
Solution Approach 1:
The patent employs preliminary action by pre-assembling the electronic module with the circuit board as an integrated unit before final integration with the display panel. This pre-assembly approach simplifies the final manufacturing step, reduces assembly time, and lowers manufacturing costs while maintaining ease of assembly. The non-overlapping arrangement further facilitates this by eliminating the need for complex alignment procedures during final assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables a thinner device with enhanced sensor and camera performance, simplifies the manufacturing process, and reduces costs by allowing the electronic module to be attached to the lower portion of the display panel during bending, ensuring high transmittance and efficient assembly.
Implementation Method 1
an intermediate layer disposed between the electronic module and the display panel... the second display area having a higher transmittance than the first display area
Implementation Method 2
the intermediate layer may include an anisotropic conductive film (ACF) including conductive particles
Data Source
AI summary
An electronic device according to an embodiment of the inventive concept includes a display panel in which a first display area and a second display area having a higher transmittance than the first display area are defined, an electronic module disposed below the second display area of the display panel, a circuit board which is connected to the display panel and on which the electronic module is mounted, and an intermediate layer disposed between the electronic module and the display panel, and the electronic module and the circuit board do not overlap each other when viewed in a plane, so that the electronic device may be made thinner, and performance of the electronic module included in the electronic device may be improved.