Under-motherboard Air Cooling Plenum for Distant PCB Components
Solution Overview
Problem
Existing airflow cooling systems in Information Handling Systems (IHS) often fail to provide sufficient cooling to components located furthest from the cooling fans, leading to increased energy consumption and noise when trying to enhance airflow velocity, and require additional complexity and cost by incorporating more fans.
Innovation Solution
The implementation of an under-motherboard air cooling plenum that draws air from cooling fans and delivers it to cooling elements on the underside of components, using a plastic duct with a wider intake section and narrowing pathway to increase airflow velocity and efficiency, thereby bypassing heat-generated air and reducing impedance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If airflow velocity of cooling fans is increased to provide better cooling to distant components, then cooling effectiveness is improved, but energy consumption and noise increase
Solution Approach 1:
An airflow plenum is introduced as an intermediary component between the cooling fans and distant hardware components. The plenum captures airflow from fans at the proximal end and channels it through a duct structure to deliver cooling air to cooling elements at the distal end, enabling effective cooling without requiring increased fan velocity
Solution Approach 2:
The cooling system transitions from a direct linear airflow path to a three-dimensional plenum-based distribution system. The plenum creates a volumetric airflow chamber that can distribute cooling air to multiple locations simultaneously, improving cooling coverage to distant components without increasing fan power requirements
2Temperature
If more cooling fans are incorporated to provide sufficient airflow to all components, then cooling coverage is improved, but device complexity and cost increase
Solution Approach 1:
The airflow plenum serves multiple functions within a single component: it acts as an airflow capture chamber, a distribution duct, and a structural support element. This multi-functional design eliminates the need for additional separate cooling fans and components, reducing overall system complexity while maintaining adequate cooling coverage
Solution Approach 2:
The plenum merges the functions of multiple potential cooling components into a single integrated structure. By combining airflow capture, channeling, and distribution functions into one plenum assembly, the system avoids the complexity of multiple separate fans and ductwork that would otherwise be required to cool all components
3Temperature
If cooling elements extend to the underside of the PCB, then cooling effectiveness is improved, but impedance and airflow resistance increase
Solution Approach 1:
The plenum acts as an intermediary airflow source that delivers cooling air directly to cooling elements on the underside of the PCB. By positioning the plenum in close proximity and providing dedicated airflow channels, the system overcomes the impedance created by the extended cooling elements, ensuring adequate airflow reaches these components without significant resistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively cools components with cooling elements protruding below the motherboard by providing cooler airflow without relying on heated air, reducing the need for increased fan velocities and minimizing noise and energy consumption.
Implementation Method 1
an IHS may utilize a cooling fan, or a plurality of cooling fans organized within an airflow cooling system... the cooling fans may ventilate heated air from within the IHS
Implementation Method 2
one or more cooling elements that extend to an underside of the PCB... the plenum delivers the air drawn via the intake to the one or more cooling elements of the first hardware component
Data Source
AI summary
Components installed on a topside of printed circuit board (PCB), such as a motherboard, are provided airflow cooling by a plurality of cooling fans located on a proximal end of the PCB. A hardware component is installed on the topside of a distal end of the PCB, furthest from the cooling fans. The hardware component includes cooling elements that extend to the underside of the PCB. Cooling the hardware component is complicated by the distance from the cooling fans and the cooling elements that extend below the PCB. A plenum extending from the proximal end of the PCB towards the distal end of the PCB is installed on the underside of the PCB. The plenum draws airflow from the cooling fans and delivers the airflow to the hardware component along the underside of the PCB, thus avoiding heating by the components on the topside of the PCB.