Under Paddle Leadfingers for High Density IC Packages
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Solution Overview
Problem
Current integrated circuit package systems face challenges in achieving high leadfinger densities, which are critical for increased performance and reduced costs, as existing solutions have not effectively addressed the need for denser leadfinger concentrations.
Innovation Solution
The method involves forming a die paddle, attaching an under paddle leadframe with lower leadfingers extending under the die paddle, and planarizing the bottom surface to separate these leadfingers, allowing for a more efficient and dense leadfinger arrangement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional leadframe structures are used with leadfingers surrounding the die attach paddle, then the package structure is simple and manufacturing is straightforward, but the leadfinger density is limited and cannot be increased further
Solution Approach 1:
The patent introduces a new dimension by placing leadfingers underneath the die attach paddle (lower leadfingers) in addition to the traditional outer row leadfingers. This vertical/dimensional extension allows leadfingers to be positioned in three-dimensional space rather than confined to a single plane, thereby increasing leadfinger density without proportionally increasing package footprint or structural complexity
Solution Approach 2:
The leadframe structure is segmented into distinct functional groups: outer row leadfingers surrounding the die attach paddle and lower leadfingers extending underneath the paddle. This segmentation allows independent optimization of each leadfinger group's position and function, enabling higher overall density while maintaining manufacturing simplicity through modular construction
2Quantity of substance
If the number of leadfingers is increased to meet growing input, output, power, and ground requirements, then performance and functionality improve, but the package size and manufacturing complexity increase
Solution Approach 1:
By extending leadfingers underneath the die attach paddle in the vertical dimension, the patent increases the number of available leadfinger connections without increasing the horizontal footprint of the package. This allows more leadfingers to be packed into the same package area by utilizing the z-axis space
3Quantity of substance
If leadfingers are placed underneath the die attach paddle, then leadfinger density increases, but the manufacturing process becomes more complex requiring additional planarization steps
Solution Approach 1:
The lower leadfingers are formed and positioned underneath the die attach paddle during the leadframe fabrication process before die attachment. This preliminary positioning allows subsequent planarization to be performed as a single integrated step after die attachment, rather than requiring multiple separate manufacturing operations, thereby reducing overall process complexity
Data Source
AI summary
A method for manufacturing an integrated circuit package system includes: forming a die paddle; forming an under paddle leadframe including lower leadfingers thereon; attaching the under paddle leadframe to the die paddle with the lower leadfingers extending under the die paddle; attaching a die to the die paddle; and planarizing a bottom surface of the under paddle leadframe to separate the lower leadfingers under the die paddle.