Under-Stacked Optical Package Layout for Compact 3D Depth Cameras
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Solution Overview
Problem
Existing 3D depth cameras face challenges in miniaturization due to the volume occupied by components such as the light source and sensor modules, leading to increased signal loss and noise interference, as well as inefficient heat dissipation from the light source.
Innovation Solution
The optical package design includes a light source module with a VCSEL and a driving IC stacked on opposite sides of a board, optimized component arrangement to reduce signal loss and noise, and efficient heat dissipation using a thermal interface material (TIM) injected into open portions of the stiffener.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of stationary object
If components are arranged in a conventional layout, then the optical package volume increases, but component arrangement flexibility is reduced
Solution Approach 1:
The patent implements under-stacking of the driving IC beneath the light source module, creating a nested three-dimensional arrangement. This vertical integration allows components to occupy overlapping horizontal spaces at different vertical levels, significantly reducing the overall footprint and volume of the optical package while maintaining all necessary component functions.
Solution Approach 2:
The patent transitions from a conventional two-dimensional planar arrangement to a three-dimensional vertical arrangement by stacking components on opposite sides of the board. The light source is positioned on the first side while the driving IC is positioned on the second side, utilizing the vertical dimension to reduce horizontal space requirements and minimize signal path lengths.
2Reliability
If component distance is increased, then signal loss increases, but noise interference decreases
Solution Approach 1:
By positioning the light source and driving IC on opposite sides of the board in a vertical stacking arrangement, the patent minimizes the horizontal distance between these critical components. This three-dimensional arrangement reduces signal path length and associated losses while the board structure provides electromagnetic shielding to minimize noise interference.
3Temperature
If light source is positioned away from board edge, then heat dissipation efficiency decreases, but structural stability improves
Solution Approach 1:
The patent extracts the heat dissipation function by providing an open portion in the board at the light source position, removing material to create a cavity that facilitates thermal management. This allows heat to be extracted more efficiently from the light source while the surrounding board structure maintains overall structural stability.
Solution Approach 2:
The patent applies local quality modification by creating an open portion specifically at the light source location on the board, while maintaining solid board structure in other areas. This localized modification optimizes heat dissipation at the critical heat-generating region without compromising the overall structural integrity of the entire board.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the volume of the optical package, optimizes component arrangement to minimize signal loss and noise, and efficiently discharges heat generated from the light source, enhancing the overall performance and miniaturization of the 3D depth camera.
Implementation Method 1
efficient heat dissipation using a thermal interface material (TIM) injected into open portions of the stiffener
Data Source
AI summary
An optical package has a light source module including a light source, a first component for driving the light source, and a light source board having a first side on which the light source is stacked and a second side on which the first component is under-stacked. The optical package has a main board in which a first region is open and to which the light source module is coupled so that the first component is positioned in the first region. Also, the optical package has a sensor module including an optical sensor board disposed to be spaced apart from the main board through a spacer, thereby defining a separation space, and a second component disposed in the separation space.