Undercut Edge Wire Encapsulation for Narrow-Bezel Substrates
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Solution Overview
Problem
Existing electronic device manufacturing technologies face challenges in achieving a narrow bezel design while ensuring the stability and protection of edge wires, which are crucial for enhancing the functional area and reducing the bezel width.
Innovation Solution
The proposed solution involves forming an edge wire on a substrate with a protection structure that includes two layers, where the edge wire is sandwiched between the substrate and the first protection layer, forming an undercut structure, and the second protection layer fills this structure, providing protection and stability to the edge wire.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a narrow bezel design is implemented to increase functional area, then the display area and touch area are enlarged, but the edge wire becomes more vulnerable to damage and harder to protect
Solution Approach 1:
The protection structure extends from the front surface into the side surface of the substrate, creating a three-dimensional protective enclosure for the edge wire. This multi-dimensional approach allows the edge wire to be protected without increasing the front bezel width, thus maintaining the narrow bezel design while improving reliability.
Solution Approach 2:
The protection structure is formed before final device assembly, creating a pre-established protective barrier around the edge wire. This preliminary protection prevents potential damage during subsequent manufacturing steps and ensures the edge wire's stability before the device is put into use.
2Length of stationary object
If the edge wire is exposed to reduce bezel width, then the functional area is increased, but the manufacturing precision and stability of the edge wire structure deteriorate
Solution Approach 1:
The edge wire is nested within the protection structure, which itself is integrated with the substrate. This nested configuration provides structural support and precision maintenance for the edge wire without increasing the external bezel dimensions, allowing for accurate positioning and stable manufacturing.
3Reliability
If a protection structure is added to protect the edge wire, then the reliability is improved, but the device complexity and manufacturing steps increase
Solution Approach 1:
The protection structure is merged with the existing substrate and edge wire assembly, forming an integrated protective unit. Rather than adding completely separate protective components, the design combines the protection function with the structural elements already present in the device, thus improving reliability while minimizing additional complexity.
Data Source
AI summary
An electronic device, including a substrate, an edge wire, a first protection layer, and a second protection layer, is provided. The substrate has a first surface, a second surface, and a side surface connecting the first surface and the second surface. A normal vector of the side surface is different from the first surface and the second surface. The edge wire is configured on the substrate, extending from the first surface to the second surface while passing through the side surface. The first protection layer is configured on the edge wire. The edge wire is sandwiched between the substrate and the first protection layer. The edge wire and the first protection layer form an undercut structure. The second protection layer is configured on the substrate and fills the undercut structure. A manufacturing method of an electronic device is also provided.