Thermosetting Underfill Composition for Low Dielectric Loss
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current underfill materials for semiconductor devices do not adequately improve RF characteristics, which are essential for emerging applications such as radio frequency devices and next-generation wireless communications systems.
Innovation Solution
A thermosetting composition comprising a mono- or bifunctional acrylic compound, a thermo-radical polymerization initiator, silica, and an elastomer with a 1,2-vinyl group, which, when cured, provides a sealant with a relative dielectric constant of 3.2 or less and a dielectric loss tangent of 0.013 or less, enhancing RF characteristics and thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional underfill materials are used to seal the gap between board and semiconductor chip, then the sealing function is achieved, but the RF characteristics are not adequately improved
Solution Approach 1:
The patent changes the chemical composition parameters of the underfill material by incorporating specific components (silica filler, elastomer with 1,2-vinyl group, mono- or bifunctional acrylic compound, and thermo-radical polymerization initiator) to achieve a relative dielectric constant of 3.2 or less and dielectric loss tangent of 0.013 or less, thereby improving RF characteristics while maintaining sealing functionality
Solution Approach 2:
The patent creates a composite underfill material combining multiple components including silica filler, elastomer with 1,2-vinyl group, acrylic compound, and polymerization initiator. This composite structure enables simultaneous achievement of low dielectric properties for RF applications and adequate sealing performance
2Reliability
If the dielectric constant is reduced to improve RF characteristics, then signal transmission quality improves, but the material composition becomes more complex
Solution Approach 1:
The patent achieves low dielectric constant (3.2 or less) and low dielectric loss tangent (0.013 or less) by carefully controlling the composition ratios and selecting specific components, thereby improving signal transmission quality without excessive complexity
Solution Approach 2:
The patent incorporates silica filler which can provide a porous or hollow structure, reducing the overall dielectric constant of the material while maintaining structural integrity and simplifying the composition compared to using complex low-k materials
3Reliability
If an elastomer with 1,2-vinyl group is added to improve elasticity and RF characteristics, then the dielectric loss is reduced, but the manufacturing process becomes more complex
Solution Approach 1:
The patent selects elastomers with specific chemical structures (1,2-vinyl group) that inherently provide low dielectric loss properties. By changing the chemical composition parameters rather than adding complex processing steps, the patent reduces dielectric loss while maintaining ease of manufacture
Solution Approach 2:
The elastomer with 1,2-vinyl group serves multiple functions simultaneously: providing elasticity for thermal expansion compensation and contributing to low dielectric loss for RF performance. This self-service approach reduces the need for additional components and simplifies the manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively improves RF characteristics and thermal resistance of semiconductor devices, ensuring reliable performance in RF applications while maintaining low dielectric loss and high elasticity.
Implementation Method 1
a thermo-radical polymerization initiator
Implementation Method 2
an elastomer including a 1,2-vinyl group
Implementation Method 3
silica; having the ability to improve the RF characteristics of a semiconductor device and also provide a semiconductor device including a sealant made of such a thermosetting composition for use as an underfill material
Data Source
AI summary
A thermosetting composition for use as an underfill material contains: a mono- or bifunctional acrylic compound; a thermo-radical polymerization initiator; silica; and an elastomer including a 1,2-vinyl group. The thermosetting composition is liquid and has a property of turning, when cured thermally, into a cured product having a relative dielectric constant of 3.2 or less at 25° C. and a dielectric loss tangent of 0.013 or less at 25° C.