Underfill Dispensing Control for 3D IC Packaging
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Solution Overview
Problem
In three-dimensional integrated circuit (3D IC) packaging, existing methods face challenges in accurately dispensing underfill material between dies to prevent voids and bridging, while ensuring optimal fillet formation, which affects the reliability and yield of semiconductor devices.
Innovation Solution
An automatic measurement system and dispensing apparatus that uses a camera and processor to monitor and control the dispensing of underfill material, ensuring the formation of precise fillets by adjusting the amount dispensed based on real-time image analysis to prevent voids and bridging between closely-spaced dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If manual dispensing methods are used for underfill material, then device complexity is reduced, but manufacturing precision and reliability deteriorate due to inaccurate control of material amount
Solution Approach 1:
The patent implements an automatic measurement system that captures images of the underfill material during dispensing, measures the fillet width in real-time, and provides feedback control to adjust the dispensing amount. This feedback mechanism ensures precise control of underfill material dispensing while maintaining manufacturing precision, directly resolving the contradiction between precision and system complexity.
2Reliability
If increased amount of underfill material is dispensed, then voids between dies are prevented, but bridging between closely-spaced dies occurs
Solution Approach 1:
The automatic measurement system monitors the fillet width of dispensed underfill material in real-time and provides feedback control to stop dispensing at the optimal point. This prevents both voids (by ensuring sufficient material) and bridging (by preventing excessive material), thereby resolving the contradiction between reliability and harmful effects.
Solution Approach 2:
The system dispenses underfill material in controlled amounts, using partial action rather than excessive dispensing. By measuring and controlling the fillet width, the system achieves the minimum necessary material amount to prevent voids without causing bridging, effectively resolving the contradiction through precise dosage control.
3Manufacturing precision
If real-time image analysis is implemented, then manufacturing precision of fillet formation is improved, but use of energy and device complexity increase
Solution Approach 1:
The system uses real-time image analysis to measure fillet width during dispensing and provides feedback control to achieve precise fillet formation. This feedback mechanism ensures high manufacturing precision while minimizing energy consumption by operating only during the critical dispensing phase, resolving the contradiction between precision and energy use.
Data Source
AI summary
Packaging methods, material dispensing methods and apparatuses, and automatic measurement systems are disclosed. In one embodiment, a method of packaging semiconductor devices includes coupling a second die to a top surface of a first die, dispensing a first amount of underfill material between the first die and the second die, and capturing an image of the underfill material. Based on the image captured, a second amount or no additional amount of underfill material is dispensed between the first die and the second die.