Closed-Loop Underfill Dispensing Adjustment for Gap Sealing
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Solution Overview
Problem
Existing fluid dispensing technologies struggle to dynamically adjust the dispensing amount of underfill materials, leading to defects in semiconductor products due to insufficient or uneven distribution, which can result in air bubbles, overflow, and contact with other electronic components.
Innovation Solution
An intelligent dispensing adjustment system incorporating an optical measuring unit and a calculating unit forms a closed loop to dynamically detect and adjust the fluid dispensing amount, using devices like laser rangefinders and CCD cameras to ensure precise control of fluid material distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If capillary diffusion is used to fill the gap between chip and substrate, then the gap can be sealed by underfill, but the filling process takes a lot of time and diffusion direction is difficult to control
Solution Approach 1:
The patent applies dynamics by making the dispensing amount adjustable and controllable in real-time. The system dynamically adjusts the underfill dispensing amount based on detected gap conditions, transforming the static capillary diffusion process into a controllable dynamic process that optimizes both filling speed and quality.
Solution Approach 2:
The patent implements feedback by using a detector to monitor the gap between chip and substrate, then using this information to adjust the underfill dispensing amount. This closed-loop feedback system ensures the underfill fills the gap efficiently without overflowing, resolving the contradiction between filling quality and efficiency.
2Reliability
If the dispensing amount is increased to ensure sufficient filling, then the gap can be properly sealed, but the underfill may overflow to contact other electronic components
Solution Approach 1:
The patent applies local quality by adjusting the underfill dispensing amount according to the local gap conditions detected by the sensor. Different regions receive different dispensing amounts based on their specific needs, ensuring sufficient filling where gaps exist while preventing overflow in regions where the gap is already filled or where electronic components are present.
Solution Approach 2:
The patent changes the dispensing amount parameter dynamically based on detected gap conditions. The system adjusts this critical parameter in real-time to match the actual filling needs, preventing both insufficient filling and overflow contact with electronic components.
3Object-affected harmful factors
If the dispensing amount is decreased to prevent overflow, then electronic components are protected, but the underfill may unevenly diffuse due to insufficient amount
Solution Approach 1:
The patent uses dynamics to adjust the dispensing amount in real-time during the filling process. The system starts with appropriate dispensing and modifies the amount based on continuous detection, ensuring uniform diffusion while preventing overflow. This dynamic adjustment resolves the contradiction between protection and uniformity.
Solution Approach 2:
The patent implements feedback control where the detector monitors the filling process and provides information to adjust the dispensing amount. This feedback mechanism ensures the underfill diffuses uniformly by maintaining the optimal dispensing rate, preventing both overflow and insufficient filling.
4Ease of manufacture
If a fixed dispensing amount is used for all chip-substrate gaps, then the dispensing process is simple, but the underfill cannot adapt to different gap sizes and positions
Solution Approach 1:
The patent transforms the static fixed dispensing amount into a dynamic adjustable parameter. The system detects gap size and position, then dynamically adjusts the dispensing amount accordingly, enabling adaptation to different chip-substrate configurations while maintaining process automation.
Solution Approach 2:
The patent uses feedback from gap detection to adjust the dispensing amount adaptively. The detector provides information about gap characteristics, and the system responds by modifying the dispensing parameters, achieving versatility across different gap conditions while keeping the manufacturing process automated and simple.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system ensures even distribution of fluid materials, preventing defects by maintaining the desired volume, weight, and ratio within gaps or grooves, thereby enhancing packaging efficiency and product quality.
Implementation Method 1
the optical measuring unit dynamically detects the state of the fluid material in the target area and generate a Nth 3-dimension (3D) fluid signal
Implementation Method 2
The underfill 'diffuses' into the gap between the chip and the substrate due to capillary
Data Source
AI summary
One embodiment of the present invention discloses an intelligent dispensing adjustment system and the method thereof. The system can dynamically detect the fluid dispensing amount of a fluid dispensing unit via a calculating unit having an intelligent dispensing mechanism and keeps monitoring the dispensing situation of the fluid material so as to automatically adjust the fluid dispensing amount of the fluid dispensing unit. The system can adjust the fluid dispensing amount of the fluid dispensing unit by obtaining the information of the state of previously dispensing the fluid material via a closed loop, which can solve the problems, of prior art, that the defects of products may be incurred because the state of the fluid material is hard to control (e.g., the fluid material is insufficient or overflows).