Underfill Resin Flow Control in Semiconductor Packaging
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Solution Overview
Problem
In semiconductor devices with miniaturized and reduced thickness, the existing methods for injecting underfill resin face challenges such as insufficient supply to end portions, unstable resin distribution, and excessive spreading, leading to performance variations due to the capillary phenomenon and repeated resin injection.
Innovation Solution
A semiconductor device and manufacturing method that incorporate a flow-inducing section near the second electronic component to actively direct the underfill resin into the gap between components, ensuring initial permeation through capillary action and preventing spreading on the substrate, using a geometry like a concave portion or opening in the solder resist to control resin flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a smaller amount of underfill resin is supplied to inhibit wet-spreading and penetration, then resin penetration to back surface is inhibited, but resin supply to end portions becomes insufficient causing capillary phenomenon failure
Solution Approach 1:
The patent introduces a flow-inducing section as an intermediary structure that mediates between the resin supply source and the gap region. This section actively directs the resin flow toward the gap, ensuring sufficient resin reaches the end portions without requiring excessive resin supply that would cause unwanted spreading or penetration.
2Manufacturing precision
If repeated injection with smaller amount of resin is performed, then wet-spreading dimension is inhibited, but resin distribution becomes unstable causing performance variations
Solution Approach 1:
The flow-inducing section is prepared in advance on the substrate before resin injection. This preliminary structure pre-establishes the resin flow path and direction, ensuring that when resin is supplied, it naturally follows the intended path into the gap without random spreading, thereby achieving stable and consistent resin distribution.
3Ease of manufacture
If conventional resin injection method is used, then simple process is maintained, but resin spreads excessively on substrate causing larger wet portion
Solution Approach 1:
The patent segments the substrate surface by introducing a flow-inducing section that creates distinct zones: a flow-induction zone that directs resin toward the gap, and a protected zone where resin spreading is prevented. This segmentation allows controlled resin distribution without complicating the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures sufficient and stable injection of underfill resin into the gap between components, preventing unwanted spreading and ensuring consistent resin distribution, thereby enhancing the reliability and performance of miniaturized semiconductor devices.
Implementation Method 1
the supplied resin penetrates through the components by a capillary phenomenon to fill thereof
Data Source
AI summary
In conventional semiconductor devices, an insufficient supply of the resin to the end portions of the components that should be encapsulated is caused, resulting in an insufficient permeation of the resin into gaps between the components and the substrate, causing a spreading resin-wet. A semiconductor device 1 includes a mounting interconnect substrate 10, a semiconductor chip 20 mounted on the mounting interconnect substrate 10, an underfill resin 30 provided in a gap between the mounting interconnect substrate 10 and the semiconductor chip 20 and a flow-inducing section 40 provided in vicinity of the semiconductor chip 20 on the mounting interconnect substrate 10 and being capable of inducing a flow of the underfill resin 30 to the gap.