Underfill Dispenser with Gas Injection for Thermal Stress Relief
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Solution Overview
Problem
The difference in coefficient of thermal expansion between electronic products, printed circuit boards, and sealing members in semiconductor modules leads to deteriorated temperature cycle reliability due to the formation of cracks during thermal cycles.
Innovation Solution
An underfill solution supplying device is used, which includes a syringe container, a plunger, and gas supply lines to introduce gases into the underfill solution, creating bubbles that form voids when cured, thereby mitigating the effects of thermal expansion differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an epoxy resin based underfill solution is dispensed to form a sealing member, then mechanical properties of the memory module are improved, but temperature cycle reliability deteriorates due to crack formation from coefficient of thermal expansion differences
Solution Approach 1:
The underfill solution is configured to contain air bubbles (porous structure) that remain trapped during dispensing and curing. These bubbles create voids within the sealing member that act as stress relief zones, preventing crack propagation caused by thermal expansion differences between components while maintaining the mechanical strength provided by the epoxy resin matrix
Solution Approach 2:
The underfill solution forms a composite material structure consisting of epoxy resin matrix with embedded air bubbles/voids. This composite structure combines the adhesive and mechanical properties of the epoxy resin with the stress-absorbing characteristics of the bubble-containing structure, achieving both improved mechanical properties and enhanced temperature cycle reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The introduction of air bubbles in the underfill solution improves temperature cycle reliability by preventing crack progression in the sealing member, enhancing the mechanical properties of semiconductor modules.
Implementation Method 1
a plunger movable within the syringe container along a length direction of the syringe container and capable of pressurizing the underfill solution
Implementation Method 2
a first gas supply line configured to supply a first gas into the syringe container through the cap, and a second gas supply line extending to the plunger through the cap, the second gas supply line being in fluid communication with a first region and configured to supply a second gas into the underfill solution to be received within the syringe container at the first region through a through hole of the plunger
Implementation Method 3
a pump configured to dispense an underfill solution through a dispenser nozzle
Data Source
AI summary
A dispenser includes a syringe container having a first end and a second end, the syringe container having a length direction extending between the first end and the second end, a plunger movable within the syringe container along the length direction of the syringe container and configured to be positioned on a surface of an underfill solution to be received within the syringe container at a first region between the plunger and the second end, a cap attached airtightly to the first end of the syringe container, a first gas supply line configured to supply a first gas into the syringe container through the cap, and a second gas supply line extending from the cap to the plunger, the second gas supply line being in fluid communication with the first region and configured to supply a second gas into the underfill solution to be received within the syringe container at the first region through a through hole of the plunger.