Underfill Inspection in IC Packages Using Vision and Thermal Control
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Solution Overview
Problem
Current methods fail to effectively and efficiently detect and address unacceptable conditions such as contamination and insufficient coverage of underfill material in integrated circuit (IC) packages, which can lead to reliability issues.
Innovation Solution
A system that captures camera images of IC packages and analyzes them using a data processor to detect contamination and ensure proper underfill material coverage, including pre-heating and post-heating the package substrate to ensure uniform spreading of the underfill material, and stopping the conveyor if unacceptable conditions are found.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional inspection methods are used for underfill material, then the inspection process is simple, but the detection effectiveness and efficiency are insufficient
Solution Approach 1:
The patent replaces traditional mechanical/optical inspection methods with a vision-based system using a camera and data processor. The camera captures images of the IC package, and the data processor automatically analyzes the images to detect underfill material conditions, substituting manual or simple optical inspection with automated digital image processing.
Solution Approach 2:
The patent creates a digital copy (image) of the physical IC package using a camera. This optical copy is then processed by the data processor to detect underfill material conditions, allowing non-contact inspection and preserving the original package while enabling detailed analysis through image manipulation and analysis algorithms.
2Reliability
If underfill material inspection is not performed, then the production speed is maintained, but contamination and insufficient coverage issues occur
Solution Approach 1:
The inspection system operates continuously without interrupting the production flow. The camera captures images and the data processor analyzes them in real-time as packages move through the production line, maintaining continuous inspection coverage without stopping production, thereby preserving both reliability checks and production efficiency.
Solution Approach 2:
The system provides immediate feedback by analyzing images and detecting unacceptable conditions such as contamination or insufficient coverage. This feedback mechanism allows for real-time quality control, where defective packages can be identified and removed from the production line promptly, preventing defective products from advancing further in manufacturing.
3Measurement precision
If the conveyor is stopped frequently for inspection, then the detection accuracy is improved, but the production efficiency decreases
Solution Approach 1:
The patent replaces physical stopping and manual inspection with automated vision-based inspection. The camera and data processor system can accurately inspect packages while they remain in motion on the conveyor, eliminating the need to stop the production line and maintaining both high accuracy and production efficiency.
Solution Approach 2:
The inspection system is positioned to capture images of packages at optimal points in the production process, allowing inspection to occur before packages move to the next stage. This preliminary inspection action ensures that defects are detected early without requiring interruption of the continuous production flow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively inspects underfill material quality, preventing contamination and ensuring complete coverage, thereby enhancing the reliability of IC packages by providing warnings and controlling the conveyor to address issues promptly.
Implementation Method 1
a camera image is captured for the IC package
Implementation Method 2
a data processor analyzes the camera image to determine an occurrence of an unacceptable condition of the underfill material
Implementation Method 3
hot air is blown toward the package substrate for the pre-heating and/or post-heating
Data Source
AI summary
In inspecting for quality of underfill material dispensed in an IC package, a camera image is captured for the IC package having the underfill material dispensed between an IC die and a package substrate. A data processor analyzes the camera image to determine an occurrence of an unacceptable condition of the underfill material. Pre-heating and/or post-heating of the package substrate before and/or after dispensing the underfill material by a contact-less heater ensures uniform spreading of the underfill material.