Underfill Dispensing Jig With Air Lock to Prevent Voids
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for dispensing underfill material between a semiconductor chip and a package substrate often result in voids and overflow, leading to inefficiencies and material waste.
Innovation Solution
A jig with a dispensing passage and air passage, along with a blocker, is used to control the dispensing of underfill material, forming an air lock to prevent voids and overflow, ensuring accurate dispensing and reducing material waste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If underfilling material is dispensed between dam and package substrate, then underfilling layer is formed, but voids form in the underfilling layer and material overflows over the dam
Solution Approach 1:
The dispensing system is segmented into multiple independent dispensing nozzles positioned at different locations. Each nozzle dispenses material independently into the gap between chip and substrate, ensuring uniform distribution without overflow or void formation. This segmentation allows precise control over material placement in different regions.
Solution Approach 2:
A carrier fluid or gas is introduced as an intermediary substance through the dispensing passage. This intermediary medium carries the underfilling material uniformly across the dispensing area and facilitates controlled distribution, preventing both void formation (by ensuring complete coverage) and overflow (by regulating flow dynamics).
2Reliability
If underfilling material is dispensed to fill space between chip and substrate, then bonding is achieved, but material waste occurs due to overflow
Solution Approach 1:
The dispensing system applies material with locally optimized characteristics - each dispensing nozzle is positioned and configured to deliver the precise amount of material needed for that specific location. The material viscosity, flow rate, and dispensing pressure are locally adjusted to match the requirements of each region, ensuring complete gap filling without excess material that would cause waste.
Solution Approach 2:
The system uses controlled partial action by dispensing material only to the extent needed to fill the gap between chip and substrate. Rather than excessive dispensing that causes overflow, the system carefully regulates the quantity and distribution of material, applying just enough to achieve reliable bonding while minimizing waste.
3Ease of manufacture
If traditional dispensing method is used, then process is simple, but voids and overflow occur leading to poor quality
Solution Approach 1:
The dispensing device integrates multiple functions into a single system - it simultaneously performs material delivery, flow control, and uniform distribution across multiple locations. The multi-nozzle configuration and integrated carrier fluid system provide universal functionality that addresses both simplicity of operation and high quality output, eliminating the need for complex separate processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The jig ensures uniform dispensing of underfill material without voids or overflow, maintaining consistent pressure and reducing material waste during semiconductor device manufacturing.
Implementation Method 1
forming an air lock to prevent voids and overflow, ensuring accurate dispensing
Implementation Method 2
The air passage is in fluid communication with the dispensing passage
Data Source
AI summary
A jig for dispensing an underfilling material may include a jig body, a dispensing passage and an air passage. The jig body may be configured to cover a package substrate on which a semiconductor chip may be mounted via conductive bumps. The dispensing passage may be formed at one side of the jig body to dispense the underfilling material between the semiconductor chip and the package substrate. The air passage may be extended from the dispensing passage to the other side of the jig body. The jig body may accurately define a dispense region of the underfilling material on an upper surface of the package substrate. Thus, it may not be required to sensitively control a discharge amount of the underfilling material so that a waste of the underfilling material may be reduced. Further, when the underfilling material may make contact with the air passage with closing of the dispensing passage by the cover, the air lock may be formed in the air passage. Thus, a void may not be formed in the underfilling material. Furthermore, an overflow of the underfilling material may be prevented.