Underfill Package Structure With Curved Film Openings
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Solution Overview
Problem
Existing semiconductor packaging technologies face challenges in manufacturing smaller, higher-density semiconductor devices due to issues with underfill material distribution and thermal stress, which affect throughput, cost, and reliability.
Innovation Solution
A method involving the use of a protective film with controlled openings to confine underfill material dispensing, ensuring precise placement and curing of underfill elements, reducing thermal stress and substrate warpage, and improving packaging efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If underfill material is dispensed without confinement, then material distribution is improved, but material usage increases and cost increases
Solution Approach 1:
The protective film is divided into multiple openings, each surrounding a specific semiconductor die structure. This segmentation allows underfill material to be confined to specific areas around each die, preventing unnecessary material usage while ensuring proper distribution where needed.
Solution Approach 2:
The protective film provides localized confinement of underfill material at each opening, allowing different areas of the substrate to have different material distribution characteristics. This ensures precise material placement only where required around semiconductor die structures.
2Manufacturing precision
If underfill material is dispensed without confinement, then material distribution is improved, but thermal stress increases
Solution Approach 1:
By segmenting the protective film into multiple discrete openings, the underfill material is confined to specific localized areas. This prevents excessive material accumulation that would generate harmful thermal stress, while still achieving proper material distribution around each semiconductor die structure.
3Manufacturing precision
If underfill material is dispensed without confinement, then material distribution is improved, but substrate warpage increases
Solution Approach 1:
The protective film is segmented into multiple openings that confine underfill material to specific areas. This segmentation prevents excessive material from causing substrate warpage, while still ensuring proper material distribution around each semiconductor die structure.
Solution Approach 2:
The protective film provides localized confinement at each opening, allowing precise control of underfill material placement. This local quality control ensures material is present where needed for proper distribution while preventing excessive material that would cause substrate warpage.
4Loss of substance
If protective film with openings is used to confine underfill material, then material usage is minimized, but device complexity increases
Solution Approach 1:
A protective film in the form of a thin flexible structure with openings is used to confine underfill material. This thin film approach provides the necessary confinement function while adding minimal complexity to the overall packaging structure, unlike more rigid or complex confinement mechanisms.
5Object-affected harmful factors
If protective film with openings is used to confine underfill material, then thermal stress is reduced, but device complexity increases
Solution Approach 1:
The protective film serves as a simple thin film structure that reduces thermal stress by confining underfill material, while adding minimal complexity to the packaging system. The film's simplicity contrasts with more complex thermal management solutions that could achieve similar stress reduction.
6Productivity
If protective film with openings is used to confine underfill material, then packaging efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The protective film with openings provides an efficient packaging solution that, while requiring precise opening placement, uses a relatively simple thin film structure. The efficiency gains from material confinement and reduced waste outweigh the increased precision requirements for opening placement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances packaging efficiency by minimizing material usage, reducing costs and time, and improving the reliability and performance of semiconductor devices by controlling underfill material distribution and thermal stress.
Implementation Method 1
The underfill material is dispensed into the opening and is then cured to form an underfill element
Data Source
AI summary
A package structure is provided. The package structure includes a substrate and a chip-containing structure over the substrate. The package structure also includes a protective layer laterally surrounding the chip-containing structure. The protective layer has a first curved interior sidewall and a second curved interior sidewall. The second curved interior sidewall is closer to the semiconductor chip than the first curved interior sidewall.