Underfill Package Structure With Protective Film Confinement
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Solution Overview
Problem
Existing 3D packaging technologies for semiconductor dies face manufacturing challenges, particularly in efficiently dispensing underfill material without causing thermal stress or warpage, which affects throughput and reliability.
Innovation Solution
A method involving a protective film with openings that confine underfill material dispensing, allowing for precise placement and curing of underfill elements, reducing thermal stress and warpage, and improving process efficiency and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If underfill material is dispensed without confinement, then dispensing process is simple, but thermal stress and warpage increase
Solution Approach 1:
The patent divides the underfill dispensing process into confined and unconfined regions using a protective film with openings. The underfill material is dispensed in a confined space between the protective film and substrate, allowing controlled dispensing that reduces thermal stress and warpage while maintaining process simplicity.
Solution Approach 2:
The protective film acts as an intermediary element between the underfill material and the external environment. It confines the underfill material during dispensing and curing, controlling the material's behavior to reduce thermal stress and warpage without complicating the overall manufacturing process.
2Reliability
If underfill material is confined during dispensing, then thermal stress and warpage are reduced, but process complexity increases
Solution Approach 1:
The protective film is divided into multiple regions including confined regions with openings and unconfined regions. This segmentation allows the underfill material to be confined only where necessary during dispensing, reducing thermal stress and warpage while keeping the overall process relatively simple by leaving other areas unconfined.
Solution Approach 2:
The patent applies different qualities to different regions of the protective film. The confined regions provide control over underfill material during dispensing to reduce thermal stress, while unconfined regions allow free expansion. This local differentiation achieves reliability improvement without excessive overall process complexity.
3Manufacturing precision
If underfill material is dispensed in large quantity, then coverage is improved, but material waste and cost increase
Solution Approach 1:
The protective film with its openings segments the underfill dispensing area, confining the material to specific regions. This segmentation ensures that underfill material is dispensed only where needed, improving coverage quality in critical areas while preventing excessive material usage and waste in other areas.
Solution Approach 2:
The patent changes the physical state and confinement parameters of the underfill material during dispensing. By confining the material in a controlled space between the protective film and substrate, the material is contained precisely where needed, achieving complete coverage without over-dispensing and subsequent material waste.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances the quality and reliability of the package structure by minimizing thermal stress and warpage, optimizing the use of underfill material, and reducing process time and cost.
Implementation Method 1
The polymer-containing liquid is cured to form an underfill element surrounding the semiconductor die structure
Data Source
AI summary
A package structure is provided. The package structure includes a substrate and a semiconductor chip over the substrate. The package structure also includes a protective film laterally surrounding the semiconductor chip. The package structure further includes an underfill element between the semiconductor chip and the protective film. A portion of the underfill element is directly below the protective film.