Underfill Material Particle Distribution for Narrow Void Sealing
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Solution Overview
Problem
Conventional underfill materials struggle to sufficiently seal voids in highly integrated semiconductor devices due to the increasing narrowness of these voids.
Innovation Solution
An underfill material comprising a curable resin component, such as an epoxy resin, and inorganic particles, where the inorganic particles have a specific particle size distribution with a limited ratio of particles below 0.5 μm and above 3 μm, and are surface-treated to achieve a coating rate of 50% or more.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional underfill materials are used, then the material can fill larger voids, but it cannot sufficiently seal narrow voids in highly integrated semiconductor devices
Solution Approach 1:
The patent changes the particle size distribution parameters of inorganic particles in the underfill material. Specifically, it limits particles with diameter ≤0.5μm to 10% or less and particles with diameter ≥3μm to 5% or less of the total. This parameter optimization enables the material to adequately fill narrow voids in highly integrated semiconductor devices while maintaining proper flow characteristics.
Solution Approach 2:
The patent uses a composite material system consisting of curable resin component and inorganic particles with specifically controlled size distribution. This composite formulation, combined with surface treatment agents, creates a material that balances flowability for narrow void filling with adequate structural support for sealing performance.
2Manufacturing precision
If the underfill material has low viscosity for effective filling, then it can flow into narrow voids, but it may lack sufficient structural support
Solution Approach 1:
The patent optimizes the particle size distribution parameters to achieve a balance between flowability and structural support. By controlling the proportion of fine particles (≤0.5μm) to be 10% or less and coarse particles (≥3μm) to be 5% or less, the material maintains low enough viscosity to fill narrow voids effectively while having sufficient particle framework to provide structural support after curing.
Solution Approach 2:
The patent applies surface treatment agents to inorganic particles at a coating rate of 50% or more, creating local quality enhancement at the particle surfaces. This surface treatment improves interparticle interactions and bonding, providing structural support while maintaining overall material flowability for narrow void filling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The underfill material exhibits excellent filling properties in narrow voids, improving the sealing efficiency in highly integrated semiconductor devices and maintaining a low viscosity for effective filling.
Implementation Method 1
including a surface treatment agent, where a coating rate of the inorganic particles coated by the surface treatment agent is 50% or more
Implementation Method 2
An underfill material including a curable resin component and inorganic particles... and a cured product of the underfill material
Data Source
AI summary
An underfill material includes a curable resin component and inorganic particles. A ratio on a number basis of particles with a particle diameter of 0.5 μm or less included in the inorganic particles is 10% or less of the total inorganic particles, and a ratio on a number basis of particles with a particle diameter of 3 μm or more is 5% or less of the total inorganic particles.