Underfill Dispensing Pulse Control for Stable Fillet Width
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Solution Overview
Problem
In the underfilling process for semiconductor packaging, existing methods face challenges in maintaining a consistent ejection amount and shape of liquid material due to changes in viscosity, leading to inadequate filling and irregular fillet formation, especially when applying the material along complex shapes or corners, which requires adjusting the dispenser speed and can result in mechanical burdens and vibrations.
Innovation Solution
A method that adjusts the number of ejection and pause pulses in ejection cycles to correct the ejection amount without changing the frequency, allowing for stable application patterns across varying shapes and penetration speeds, using a control unit to manage the ejection device's operation and ensure consistent application without altering the moving speed or length of the application pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the dispenser speed is adjusted to maintain consistent ejection amount along complex shapes or corners, then the application precision is improved, but the mechanical burden and vibrations increase
Solution Approach 1:
The application pattern is divided into multiple segments (first application region, second application region, third application region) with different ejection cycle configurations. Each segment can be independently optimized for its specific geometric requirements, allowing precise material application along complex shapes and corners without requiring speed adjustments that would increase mechanical burden.
Solution Approach 2:
The system dynamically switches between different ejection cycle types (first, second, third ejection cycles) based on the current application region. This dynamic adaptation allows the ejection parameters to be optimized for each specific region's requirements, maintaining application precision while avoiding the need to change overall dispenser speed.
2Quantity of substance
If the number of ejection pulses is increased to compensate for viscosity change, then the ejection amount is improved, but the application pattern consistency deteriorates
Solution Approach 1:
Different ejection cycles with different numbers of ejection pulses are assigned to different application regions based on local requirements. The first ejection cycle uses a first number of ejection pulses for the first application region, the second ejection cycle uses a second number for the second region, and the third ejection cycle uses a third number for the third region. This local optimization ensures each region receives the appropriate material quantity while maintaining overall pattern consistency.
Solution Approach 2:
The system changes the number of ejection pulses parameter in different ejection cycles to compensate for viscosity changes and ensure consistent material application. By adjusting this parameter locally in different regions rather than globally, the system maintains application pattern consistency while achieving the required ejection amount.
3Quantity of substance
If the ejection frequency is changed to control ejection amount, then the material application quantity is improved, but the application speed stability deteriorates
Solution Approach 1:
The system uses periodic ejection cycles with different numbers of ejection pulses (first, second, third ejection cycles) to control material application quantity. Each ejection cycle is a periodic sequence that can be repeated, allowing precise control of ejection amount through the number of pulses in each cycle while maintaining stable application speed through consistent cycle timing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables precise control over the ejection amount, maintaining a constant fillet width and reducing mechanical burdens, allowing for accurate and efficient application of liquid material across different shapes and speeds, improving the stability and accuracy of the underfilling process.
Implementation Method 1
filling the resin into a gap between the semiconductor chip and the substrate by utilizing a capillary action
Data Source
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Figure 3(a)~3(c)
AI summary
Provided are a method for filling a liquid material, and an apparatus and a program for the same, which make it possible, without changing a moving speed of an ejection device, to correct a change in ejection amount and to stabilize an application shape. Disclosed are: a method for filling a liquid material into a gap between a substrate and a work by using the capillary action; and an apparatus and a program for the same. The method comprises the steps of: generating an application pattern consisting of a plurality of application areas continuous to one another; assigning a plurality of ejection cycles, each obtained by combining the number of ejection pulses and the number of pause pulses at a predetermined ratio therebetween, to each of the application areas; and measuring an ejection amount at correction intervals and calculating a correction amount for the ejection amount. The method further comprises at least any one of the steps of: adjusting the numbers of ejection pulses and the numbers of pause pulses, which are included in the application pattern, based on the calculated correction amount; and adjusting the length of any application area continuous to at least one application area without changing ejection amounts per unit time in the respective application areas.