Underfill Resin Composition With Infrared Flow Control

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

The challenge is to improve the fluidity and filling properties of underfill materials injected between a semiconductor chip and a substrate, while preventing the underfill from flowing outside the semiconductor chip, which can cause defects.

Innovation Solution

A resin composition is used that includes an epoxy resin, a curing agent, a filler, and an infrared absorber. Infrared light is projected onto the resin composition to locally increase its temperature and viscosity, controlling the flow of the underfill and preventing it from spreading outside the chip.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the viscosity of underfill materials is reduced to improve fluidity and filling properties, then the filling performance improves, but the underfill flows outside the semiconductor chip causing defects

Engineering Contradiction:

Improvefilling performanceVSAvoidexcessive flow outside chip

Core Design Contradiction:

Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The patent applies local quality by creating different viscosity regions within the underfill material through selective infrared heating. The infrared absorber causes localized temperature increase in specific areas, resulting in spatially varying viscosity that controls flow patterns - lower viscosity where filling is needed and higher viscosity where flow control is required

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent utilizes parameter changes by dynamically adjusting the viscosity parameter of the underfill material through infrared heating. The temperature parameter is changed locally and temporarily during the dispensing process, which directly affects the viscosity parameter to control material flow behavior in real-time

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method effectively controls the flow of underfill, improving its reliability by preventing defects caused by excessive spreading, while maintaining the necessary fluidity for proper filling between the chip and substrate.

Implementation Method 1

the resin composition includes 1 to 5 wt % of an infrared absorber... projecting infrared light onto at least a portion of the outside portion of the resin composition

Methodology Applied

Scientific EffectInfrared absorption: Absorption (EM radiation)

Implementation Method 2

projecting infrared light onto at least a portion of the outside portion of the resin composition, while the resin composition flows to an opposite side of the semiconductor chip

Methodology Applied

Scientific EffectThermal heating: Heating

Data Source

PatentUS20250293202A1Resin composition and method of forming a semiconductor package with underfill using the same

Publication Date: 2025.09.18 SAMSUNG ELECTRONICS CO LTD

AI summary

A method of manufacturing a semiconductor package that includes mounting a semiconductor chip on a substrate, dispensing a resin composition to a first side of the semiconductor chip, in which the resin composition includes a filling portion flowing to an inside region of the semiconductor chip between the semiconductor chip and the substrate, and an outside portion flowing outside the semiconductor chip; and projecting infrared light onto at least a portion of the outside portion of the resin composition, while the resin composition flows to an opposite side of the semiconductor chip that is opposite from the first side of the semiconductor, wherein the resin composition includes 20 to 40 10 wt % of an epoxy resin, 5 to 10 wt % of a curing agent, 50 to 70 wt % of a filler, and 1 to 5 wt % of an infrared absorber.