Underfill Resin Composition for Flowability and Low Elastic Modulus
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Solution Overview
Problem
Existing liquid encapsulation resin compositions for semiconductor devices have high flowability at room temperature but fail to achieve a sufficiently low elastic modulus in their cured products, making it difficult to balance flowability and mechanical properties.
Innovation Solution
A liquid encapsulation resin composition comprising silica, an epoxy resin, a curing agent, a curing accelerator, and a triblock copolymer with specific segment blocks of methyl methacrylate and 2-ethylhexyl acrylate, which adjusts the elastic modulus and flowability of the cured product.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional liquid encapsulation resin compositions are used, then high flowability at room temperature is achieved, but the elastic modulus of the cured product remains too high
Solution Approach 1:
The patent uses a composite material system combining epoxy resin, polyether resin, and a specific triblock copolymer (formula 1) with distinct segment blocks. This multi-component composite approach allows the uncured mixture to maintain high flowability while the cured product achieves reduced elastic modulus through the synergistic interaction of different polymer phases and the triblock copolymer's unique structure.
Solution Approach 2:
The patent changes the chemical composition parameters by introducing a triblock copolymer with specific segment blocks (formula 1) and controlling their ratios. The segment blocks provide different mechanical properties, and by adjusting the composition parameters within specified ranges, the material achieves both high flowability in uncured state and low elastic modulus in cured state.
2Reliability
If the elastic modulus of the cured product is reduced, then the likelihood of cracks at die corner portions decreases, but the flowability of the uncured product may be compromised
Solution Approach 1:
The triblock copolymer with segment blocks provides local quality differentiation within the material system. The segment blocks create localized soft phases that specifically address stress concentration at die corner portions, reducing crack likelihood, while the overall composition maintains high flowability for proper filling of the underfill gap.
Solution Approach 2:
The triblock copolymer acts as a beforehand cushioning agent by incorporating soft segment blocks that preemptively reduce stress concentration in the cured product. This prevents crack formation at die corner portions before they can occur during thermal cycling or mechanical stress, while not interfering with the flowability needed for proper encapsulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively decreases the elastic modulus of the cured product while maintaining high flowability of the uncured product, suitable for use as an underfill material in semiconductor devices, reducing the likelihood of cracks at corner portions of the die.
Implementation Method 1
The liquid encapsulation resin composition contains a triblock copolymer with specific segment blocks that adjusts the elastic modulus and flowability of the cured product, decreasing the elastic modulus while maintaining high flowability
Implementation Method 2
The liquid encapsulation resin composition contains an epoxy resin, a curing agent, and a curing accelerator, forming a cured product through chemical reaction
Data Source
AI summary
A liquid encapsulation resin composition contains a silica (A), an epoxy resin (B), a curing agent (C), a curing accelerator (D), and a triblock copolymer (E) expressed by the formula (1): X−Y−X, where X is a segment block including a polymer of methyl methacrylate and Y is a segment block including a polymer of monomer components containing 2-ethylhexyl acrylate. The percentage of the triblock copolymer (E) to the total of the epoxy resin (B), the curing agent (C), and the curing accelerator (D) is equal to or greater than 1.0% by mass and equal to or less than 9.5% by mass.