Pre-Applied Underfill Resin Composition for Oxide Removal Stability
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Solution Overview
Problem
Existing pre-applied underfill materials for semiconductor devices face challenges such as poor flux activity, instability, and inability to effectively remove oxidized layers, leading to issues like short circuits and malfunction due to copper corrosion, especially when using epoxy compounds or radical polymerizable monomers with carboxyl groups.
Innovation Solution
A resin composition comprising a compound with a phenolic hydroxy group, a metal ion trapping agent, and a radical polymerizable compound, which enhances flux activity, flexibility, and storage stability, suitable for use as an underfill material in flip chip bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If epoxy compounds are used as pre-applied underfill material, then adhesiveness and electrical insulation properties are improved, but flux activity is insufficient and oxidized layers cannot be removed
Solution Approach 1:
The patent combines epoxy compounds with carboxyl group-containing compounds in a single underfill material formulation. The epoxy resin provides adhesiveness and electrical insulation, while the carboxyl group-containing compound provides flux activity to remove oxidized layers. This merging of multiple functional components into one material system resolves the contradiction between reliability and oxidized layer removal capability.
Solution Approach 2:
The invention creates a composite underfill material consisting of epoxy resin as the base material and carboxyl group-containing compounds as functional additives. This composite structure allows the material to simultaneously exhibit the adhesive and insulating properties of epoxy while gaining the flux activity of carboxyl compounds, thereby resolving the technical contradiction.
2Object-generated harmful factors
If carboxyl group containing compound is added to provide flux activity, then oxidized layer removal is improved, but reaction with epoxy compound reduces flux activity over time during storage
Solution Approach 1:
The patent carefully controls the concentration ratio of carboxyl group-containing compound to epoxy compound within specific ranges (0.01-10 wt% carboxyl compound relative to epoxy). By optimizing these compositional parameters, the invention achieves sufficient flux activity while minimizing premature reaction during storage, thus resolving the contradiction between oxidized layer removal capability and storage stability.
3Length of moving object
If electrode pitch is narrowed for downsizing, then device performance is improved, but filling time increases and filling failures occur
Solution Approach 1:
The invention applies underfill material in advance to the chip or substrate before the actual bonding process. This preliminary application ensures that the underfill is already in position and properly distributed when bonding occurs, eliminating filling time delays and preventing filling failures even with narrow electrode pitches. The material is prepared and positioned beforehand, ready for immediate bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition effectively removes oxidized layers, prevents copper corrosion, and ensures stable joint formation, improving the reliability and productivity of semiconductor device mounting processes.
Implementation Method 1
a compound (A) having a phenolic hydroxy group... effectively removes oxidized layers
Implementation Method 2
a metal ion trapping agent (B)... prevents copper corrosion
Implementation Method 3
a radical polymerizable compound (C)... ensures stable joint formation
Data Source
AI summary
A resin composition that has excellent flux activity, flexibility and storage stability and that is suitable for a pre-applied underfill material is provided. The resin composition contains a compound (A) having a phenolic hydroxy group, a metal ion trapping agent (B) and a radical polymerizable compound (C).