Semiconductor Underfill Resin Stop Portion Warping
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Solution Overview
Problem
The existing semiconductor devices with flip chip mounting experience warping due to stress from thermal contraction of underfill materials, which requires a wider fillet formation, increasing the circuit board size and complicating the mounting of passive elements.
Innovation Solution
A semiconductor device and fabrication method where a resin stop portion is used to restrict the filling resin within the chip mount area, preventing it from running out and forming a narrower contact area, thereby reducing stress from thermal contraction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the fillet is formed long to ensure proper sealing, then the sealing reliability is improved, but the contact area between the circuit board and underfill material becomes wider, causing increased stress from thermal contraction and making the circuit board more prone to warping
Solution Approach 1:
The invention applies different properties to different parts of the underfill material configuration. Specifically, a resin stop portion is provided at a specific location to prevent the underfill material from forming a long fillet in certain areas, thereby creating a localized restriction that reduces the contact area and stress application range on the circuit board, while still maintaining adequate sealing where needed.
2Reliability
If the fillet is formed long to ensure proper sealing, then the sealing reliability is improved, but the area required around the semiconductor chip increases, necessitating a larger circuit board size
Solution Approach 1:
The resin stop portion creates a localized restriction that prevents the underfill material from extending unnecessarily, thereby reducing the required area around the semiconductor chip while maintaining adequate sealing reliability in the critical regions.
3Reliability
If the fillet is formed long to ensure proper sealing, then the sealing reliability is improved, but the range where stress is applied on the board surface widens, making it harder to mount passive elements
Solution Approach 1:
By providing a resin stop portion at a specific location, the invention locally restricts the underfill material flow, thereby narrowing the stress application range on the board surface and creating more space for mounting passive elements, while still ensuring adequate sealing reliability in the critical areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces warping of the circuit board, improves connection reliability, minimizes material usage and manufacturing costs, and allows for a smaller circuit board size by limiting the fillet formation area.
Implementation Method 1
The underfill material is filled between the circuit board and the semiconductor chip using the capillarity
Data Source
AI summary
A semiconductor device includes: a mount body; a semiconductor chip mounted on the mount body via projecting connecting terminals; and a filling resin filled between the mount body and the semiconductor chip to seal the connecting terminals, the filling resin being retained inside the semiconductor chip in such a way as not to run out of at least one side portion in four side portions defining an outer peripheral portion of the semiconductor chip.